Chip IP

Services

Intellectual Property (IP) & Process Technology, SoC/ASIC Development Platform, Design Flow, Packaging & Testing, Production Service, Application-Oriented Value-Added Services

IP Cores

USB3.1 Gen1 IP Solutions, Technology Optimized Standard Cell Library, ESD Robust Multi-Voltage I/O, Low Power SRAM with High Production Yield

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IP Cores

Analog-to-Digital Converters, Digital-to-Analog Converters, Temperature, Voltage, and Process Monitors, Ultra-Low-Power IoT IP

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Services

Physical Design, RTL Synthesis and verification, STA

IP Cores

DDR

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Services

Advanced ASIC Development, New Product Introduction (NPI) Engineering, High Volume Manufacturing (HVM) Enablement

IP Cores

HBM3 PHY & Controller, Non-Coherent Network-on-Chip (NOC), Coherent Network-on-Chip (NOC), DDR5/4 PHY & Controller, Die-to-Die (D2D) Interconnect, Analog & Configurable I/Os

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Services

IP Provider for unique I/O and ESD protection, Custom I/O and ESD Design

IP Cores

Low Voltage ESD/EOS protection (up to 5V), HV/BCD EOS/ESD protection (5V and higher), LIN PHY (transceiver) , Programmable Clipping Circuit for Antenna pins, Radiation hard circuits, IP for chiplet Die-2-Die interfaces

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