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USA
Packet Digital has a team of skilled engineers ready to help design, verify, and implement your FPGA or ASIC solution. Specializing in analog and mixed-signal designs, the team can take your design from requirements capture to customer delivered silicon.
Analog Circuit Design, Digital & Mixed Signal Design, Verification, Concept to Silicon
View vendor pagePIC Design Service, PIC Consultancy Service, PIC Testing Service (Die and Wafer level), PIC Packaging Service, PIC Manufacturing Service, PIC Training Service
View vendor pageGermany
iC-Haus GmbH is a leading independent German manufacturer of application-specific standard iCs (ASSPs) and customized ASiC semiconductor solutions. Our proprietary cell libraries in CMOS, Bipolar, and BCD technologies are used in smart sensor, laser/opto, and actuator iCs.
Germany
AEMtec is the Strategic Technology Partner for advanced Microsystems, Opto-Electronics, Wafer back-end and Packaging Services.
Development and Process Engineering, High Standard of Technological Equipment, Wafer Back-End Services
View vendor pageUSA
Microtek provides optimum microelectronics packaging solutions focusing on the design, engineering and manufacturing of R&D level projects.
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