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Featured Vendors

Application-Specific Integrated Circuit (ASIC) design services, IP and turnkey solutions since 2006. Our ASICs include analog, mixed-signal and digital functionality.

Digicomm Semiconductor is a specialized engineering firm providing advanced end-to-end ASIC design, Packaging, and embedded software services.

IMEC

Belgium

Imec.IC-link is the semiconductor manufacturing division of imec. We help innovators, entrepreneurs and universities realize their ideas in silicon by providing low-cost prototyping, volume production and system integration of electronic assemblies.

More than 500 IC projects tape-out a year. Co-work with more than 300 companies and more than 700 universities.

HCLTech

Global

HCLTech is a leading ASIC Design services company with more than 27 years of experience in providing semiconductor services with focus on full Turnkey ASIC design service.

Kamaten primary business is development and maintenance of Analog and Mixed Signal IP portfolio. We are also a design service provider.

SmartSoC Solutions, a global company providing turnkey solutions for ASIC/SOC and Chip to Product, Digital Design (RTL, Verification, DFT, PD, Emulation, Validation) and Analog Mixed signal IP design (Circuit design and Mask Design).

Established in 2003, KAL provides semiconductor deep tech consultancy and ASIC program management. KAL works with worldwide partners to deliver VLSI deep tech development, including digital, RF, and analog ASIC design services, supply chain services, IP cores, and libraries. We are capable of executing full spec to production projects and delivering fully tested ICs in high volume.

Advanced Silicon

Switzerland

Advanced Silicon is a fabless mixed-signal IC solution provider for High-Voltage, High-pin count, and ultra-low noise peripheral SOCs.

Etesian offer a Boutique Foundry support model for Design, manufacturing and sale of high complexity integrated circuit.

TES is a leading German ASIC Design House and IP company and provides embedded software, hardware, RF and antenna design services.

iNPACK

Israel

Complete OSAT solution: Single Die, MCM, Packaging Design, Substrates and Miniaturized PCBs, 3D Packaging, Test Services, Full Turnkey.

Taiwan Technology Innovations (TTI) provide quality and cost-effective outsourced semiconductor assembly and testing services to customer.

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