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Featured Vendors

ICsense

Belgium

ICsense offers mixed-signal IC design and ASIC supply services for the automotive/aerospace, industrial, consumer and medical markets. The company is ISO9001:2008 and ISO13485 certified with design HQ in Belgium and sales in Japan, U.S. and Germany.

GLOBALFOUNDRIES is the world’s first full-service semiconductor foundry with a truly global footprint.

A leading fabless ASIC / SoC design service and silicon IP provider with 20 years of experience.

Neways Advanced Microsystems develops and produces functional plastic encapsulation solutions for MEMS and sensor systems for harsh environments like automotive motor oil applications.

Noesis Technologies is a Silicon IP provider specialized in hardware implementation of complex telecom algorithms for wireless and wireline applications.

RFIC Solutions designs disruptive MMIC SoCs for industries like 5G, Fixed Wireless Access, SATCOM, IOT, Wigig, Wireless Power Transfer, CATV, MIPI, etc. We have expertise in GaAs, GaN, SiGe BiCMOS, Silicon CMOS, other HBT processes as well as hybrid technologies like IPD/LTCC/Thick/Thin film/PCB.

EKSS Microelectronics was established in 2002 and provides Complex IC Product and Test Engineering, Assembly,Supply Chain Services & Consultancy to the Fabless Semiconductor & IC Design House community.

Allegro DVT

France

Allegro DVT provides Digital Video Compression Solutions, offering Encoder, Decoder, Pixel Processing IPs and industry-standard Compliance Test Suites.

Application-Specific Integrated Circuit (ASIC) design services, IP and turnkey solutions since 2006. Our ASICs include analog, mixed-signal and digital functionality.

iNPACK

Israel

Complete OSAT solution: Single Die, MCM, Packaging Design, Substrates and Miniaturized PCBs, 3D Packaging, Test Services, Full Turnkey.

Tekmos

USA

Tekmos delivers ASIC solutions replacing FPGAs, ASICs, Legacy Microprocessors and Flash Memory. Tekmos supports Defense, Medical and High Temperature applications.

Integra Technologies and its full-turnkey capabilities of die preparation, packaging, testing and characterization of Hi-Rel semiconductor components and related value-added services.

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