The Google of the Semiconductor Industry

We provide RFIC, analogue, and mixed signal ASIC design services focused on IoT sensor node design and other markets.

Complete OSAT solution: Single Die, MCM, Packaging Design, Substrates and Miniaturized PCBs, 3D Packaging, Test Services, Full Turnkey.

As one of the leading independent fabless IC-Design institutions in Europe, Fraunhofer IIS offers turnkey solutions for customized mixed-signal ASICs and integrated sensor systems with over 30 years of experience.

EKSS Microelectronics was established in 2002 and provides Complex IC Product and Test Engineering, Assembly,Supply Chain Services & Consultancy to the Fabless Semiconductor & IC Design House community.

Alter Technology are an OSAT providing assembly/packaging test and qualification services in the semiconductor industry.

SignOff Semiconductors is having best-in-class expertise in all aspects of ASIC / SOC Design Services from spec-to-silicon.

SkyWater Technology specializes in new technology process development and volume manufacturing ICs for mil/aero, consumer, medical, industrial and automotive markets.

Green Mountain Semiconductor provides full custom circuit design and layout services, from individual expert contracting to turn-key product development.

EnSilica expertise in the design and supply of custom analogue, mixed signal and digital IC’s in the consumer, automotive, industrial and communications markets.

Leader in ultra low power analogue and mixed signal ASIC design and IP licensing, including RF, image sensor and SOC.

TES is a leading German ASIC Design House and IP company and provides embedded software, hardware, RF and antenna design services.

Specialists in developing silicon designs (ASIC) for portable and wireless applications. Focus on low power and miniaturization with a broad portfolio of IP building blocks.