The Google of the Semiconductor Industry

Integra Technologies and its full-turnkey capabilities of die preparation, packaging, testing and characterization of Hi-Rel semiconductor components and related value-added services.

Tessolve is the market leader in providing engineering solution for silicon and systems development. We offer a unique combination of both pre-silicon and post silicon expertise to provide an efficient turnkey solution for silicon bring up, spec to product.

VConneTech Systems is an engineering-driven technology company delivering end-to-end solutions across semiconductor design, embedded systems, AI, hardware engineering, and manufacturing.

Since 2004, IC Enable has successfully delivered design and layout services with exemplary quality from test chips to full-custom ASICs.

Device Engineering is a Tempe, AZ, USA-based design and manufacturing facility specializing in Analog and Mixed-Signal Integrated Circuits.

Complete OSAT solution: Single Die, MCM, Packaging Design, Substrates and Miniaturized PCBs, 3D Packaging, Test Services, Full Turnkey.

ChipGlobe offers ASIC/FPGA Design Services in Design Centers in Munich, Belgrade, Singapore: RTL2GDS, Functional Verification, Embedded Systems + Prototypes.

As one of the leading independent fabless IC-Design institutions in Europe, Fraunhofer IIS offers turnkey solutions for customized mixed-signal ASICs and integrated sensor systems with over 30 years of experience.

A leading fabless ASIC / SoC design service and silicon IP provider with 20 years of experience.

SignOff Semiconductors is having best-in-class expertise in all aspects of ASIC / SOC Design Services from spec-to-silicon.

GLOBALFOUNDRIES is the world’s first full-service semiconductor foundry with a truly global footprint.

Develops electronics for sensors, cameras and image processing. We also offers customized Machine Vision solutions.