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Featured Vendors

A leading fabless ASIC / SoC design service and silicon IP provider with 20 years of experience.

Know-how and lengthy experience is what makes us successful in the design of analog, digital and Mixed-Signal ASICs. Your partner for future-oriented, Cost-optimized ASIC solutions.

iNPACK

Israel

Complete OSAT solution: Single Die, MCM, Packaging Design, Substrates and Miniaturized PCBs, 3D Packaging, Test Services, Full Turnkey.

Device Engineering is a Tempe, AZ, USA-based design and manufacturing facility specializing in Analog and Mixed-Signal Integrated Circuits.

XQWave

India

XQWave is a semiconductor consulting firm delivering end-to-end ASIC, embedded, and silicon solutions with deep industry expertise and proven execution.

Since 2004, IC Enable has successfully delivered design and layout services with exemplary quality from test chips to full-custom ASICs.

Struent Semiconductors is a Semiconductors startup based out of India, offering turnkey, Time & Material and custom business models for ASIC/SoC development, specializing in low-power and Lower Technology nodes.

IC-Logic

Germany

IC-LOGIC is a Microchip design company with focus on analog, digital and mixed signal ASIC designs.

DXCorr designs memory compilers as well as standard cell libraries to meet the stringent requirements for SoC designs.

GEDEC

Italy

GEDEC (GEnova DEsign Center) is an independent electronic system and integrated circuit design house, mainly focused in advanced electronic and ICs microelectronics design.

Turnkey provider of packaging design, assembly and test services. Global operations include 11M ft2 of volume production, development, sales & support.

RFIC Solutions designs disruptive MMIC SoCs for industries like 5G, Fixed Wireless Access, SATCOM, IOT, Wigig, Wireless Power Transfer, CATV, MIPI, etc. We have expertise in GaAs, GaN, SiGe BiCMOS, Silicon CMOS, other HBT processes as well as hybrid technologies like IPD/LTCC/Thick/Thin film/PCB.

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