November 12, 2026 –– ASICLAND (KOSDAQ: 445090), an application-specific integrated circuit (ASIC) design solutions provider led by CEO Jong-min Lee, participated in TSMC’s Taiwan Open Innovation Platform (OIP) Forum for the third consecutive year, showcasing customer-developed semiconductor chips for AI servers, storage, and AI system-on-chip (SoC) applications.
ASICLAND announced its participation as an exhibitor at the TSMC 2026 Taiwan OIP Ecosystem Forum, held on November 12 at the Sheraton Hotel in Hsinchu, Taiwan. This year’s OIP forums are being held across North America, Japan, Taiwan, China, and Europe. Following its participation in the North American forum in September, ASICLAND met with global fabless companies and OIP partners in Hsinchu, where TSMC is headquartered, to present its custom ASIC design and mass production capabilities. The event provided opportunities to strengthen technical collaboration and expand business connections within TSMC’s core semiconductor ecosystem.
ASICLAND employees and representatives pose for a group photo in front of the company’s booth at the TSMC 2026 Taiwan OIP Ecosystem Forum.
TSMC’s forum theme, ‘Expanding AI with Leadership Ecosystem,’ reflects rapidly growing AI demand and the increasing complexity of semiconductor technologies. As AI adoption expands beyond data centers into various industries, leading-edge process technologies, high-bandwidth memory (HBM), and advanced packaging are becoming increasingly important for improving computing performance and power efficiency.
As semiconductor processes advance and integration density increases, comprehensive capabilities spanning design, process technologies, and packaging are becoming essential. This trend aligns with ASICLAND’s business strategy. As Korea’s only TSMC Value Chain Alliance (VCA) partner, ASICLAND leverages its expertise in semiconductor design and packaging to provide integrated turnkey solutions covering the entire process from chip design to mass production.
In line with these industry trends, ASICLAND showcased three semiconductor chips developed through actual customer projects: an AI SoC, a Vector Data Processing Unit (VDPU) for AI servers, and a PCIe Gen6 enterprise SSD (eSSD) controller. All three products are based on TSMC process technologies and address key areas of AI infrastructure, including AI processing, server computing, and data storage.
The AI SoC is designed for edge AI applications, enabling AI processing directly on devices such as cameras and networking equipment. The VDPU supports large-scale vector data processing in AI servers, while the PCIe Gen6 eSSD controller manages high-speed data input and output for data center SSDs. All three chips are custom ASICs designed to meet specific customer requirements, demonstrating ASICLAND’s experience in executing semiconductor design and mass production projects across diverse applications.
An ASICLAND representative explains AxHub to a visitor at the company’s exhibition booth.
ASICLAND continues to advance its research into TSMC’s leading-edge process and packaging technologies through its R&D center in Hsinchu, Taiwan. Established in November 2024, the Taiwan R&D center marks its second anniversary this year.
Hsinchu is a major global semiconductor hub, home to TSMC’s headquarters and numerous semiconductor IP, packaging, and testing companies. Leveraging this local ecosystem, ASICLAND is strengthening collaboration with key technology partners and responding rapidly to advances in leading-edge processes and advanced packaging. The company is particularly focused on enhancing its design capabilities for TSMC’s advanced packaging technologies, including CoWoS, and chiplet-based solutions to improve the technical quality of global customer projects.
Under its collaborative operating model, ASICLAND’s Korean headquarters oversees customer engagement and tape-out activities, while the Taiwan R&D center supports leading-edge process and packaging research. This structure helps improve development efficiency for global customer projects and strengthens the foundation for subsequent mass production. Reflecting its expanding global business, ASICLAND recorded overseas revenue of approximately KRW 20.6 billion in the second quarter of 2026, representing an increase of approximately 93% from the previous quarter.
“As AI semiconductors become increasingly sophisticated, ecosystem collaboration across design, process technologies, and packaging is becoming more important than ever,” said Seok-yong Lee, Head of Global Strategy Division at ASICLAND. “Following our participation in North America, we have also demonstrated our custom ASIC design and mass production experience in Taiwan. By strengthening collaboration between our headquarters and Taiwan R&D center, we aim to enhance our ability to serve global customers and build long-term partnerships that extend into subsequent mass production.”
ASICLAND is Korea’s only TSMC VCA partner, providing comprehensive semiconductor design solutions covering the entire development process, from ASIC design and verification to tape-out, process technology support, packaging, and mass production.
