Reply To: Yield estimation

Yield estimation is an art and it depends upon many parameters that affect the yield and not to forget the Die Per Wafer (DPW). E.g. - Design complexity, test coverage and test limits, Packaging specifications ...etc. - Edge exclusion zone 0, 3 or 6 mm -> 31415, 29.559, and 27,759 sqmm/wafer (8" wafer), 80um-100um scribeline, test structures, e.g. The simple prediction is the thumb rule: 99%-area in mm2 = 99%-8.4 = 90.6%. Do not use this for very small or very large dies. Another approch is to list the flow and add the individuel percentages: Wafer mfg. -> Wafer Level Test -> Packaging -> Component Level test -> T&R 100% -> 75% -> 96% -> 96% -> 99,99% The figures above is for a product where the WLT yield is low compared to the packaging price - therefore the WLT is reuired. Best regards Henrik