Lead Frame

Lead frame is an alloy frame that consists of the package leads and the paddle. The silicon die is attached on the paddle and the leads are connected to the die with wirebonds.

Recent Stories

Building a Fabless Semiconductor Business:

Building a Fabless Semiconductor Business:

Chiplet Summit 2025

Chiplet Summit 2025

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UMC Secures Major Advanced Packaging Order from Qualcomm, Challenging TSMC’s Dominance

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Cadence Appoints Moshe Gavrielov to Board of Directors

Apple’s First AI Server Chip to be Engineered in Israel

Apple’s First AI Server Chip to be Engineered in Israel

Biden-Harris Administration Announce Preliminary Terms with Coherent, SkyWater, and X-Fab to Advance U.S. Supply Chain Security

Biden-Harris Administration Announce Preliminary Terms with Coherent, SkyWater, and X-Fab to Advance U.S. Supply Chain Security

MosChip selects Cadence tools for the design of HPC Processor “AUM” for C-DAC

MosChip selects Cadence tools for the design of HPC Processor “AUM” for C-DAC

ROHM and TSMC Launch Strategic Gallium Nitride Technology Collaboration for Automotive Industry

ROHM and TSMC Launch Strategic Gallium Nitride Technology Collaboration for Automotive Industry