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Featured Vendors

iNPACK

Israel

Complete OSAT solution: Single Die, MCM, Packaging Design, Substrates and Miniaturized PCBs, 3D Packaging, Test Services, Full Turnkey.

ChipGlobe

Germany

ChipGlobe offers ASIC/FPGA Design Services in Design Centers in Munich, Belgrade, Singapore: RTL2GDS, Functional Verification, Embedded Systems + Prototypes.

NTLab

Lithuania

ASIC design service and silicon IP provider specializing in analog/mixed-signal and RF design (GNSS, RFID, telecom, medical, sensors).

SEMICONDUCTORS BACK-END SERVICES: IC’s Testing, IC’s Packaging, IC’s qualification-Reliability, IC’s Supply Chain and PCB Design and Fabrication.

AnaBatIC Semiconductor

Republic of Korea

Anabatic Semiconductor, specialized in BMS(Battery Management System), competitive AFE(Analog Front End, e.g Customized AFE) and wireless BMS.

RAME srl is a fabless ASIC & IP design company specializing in frequency synthesizers, energy-efficient power management and AD converters.

Tekmos

USA

Tekmos delivers ASIC solutions replacing FPGAs, ASICs, Legacy Microprocessors and Flash Memory. Tekmos supports Defense, Medical and High Temperature applications.

Know-how and lengthy experience is what makes us successful in the design of analog, digital and Mixed-Signal ASICs. Your partner for future-oriented, Cost-optimized ASIC solutions.

ELECTRA IC

TURKIYE

ElectraIC develops ASIC / FPGA, microchip and embedded software/systems, electronic circuit design and verification projects.

Struent Semiconductors is a Semiconductors startup based out of India, offering turnkey, Time & Material and custom business models for ASIC/SoC development, specializing in low-power and Lower Technology nodes.

Application-Specific Integrated Circuit (ASIC) design services, IP and turnkey solutions since 2006. Our ASICs include analog, mixed-signal and digital functionality.

IMEC

Belgium

Imec.IC-link is the semiconductor manufacturing division of imec. We help innovators, entrepreneurs and universities realize their ideas in silicon by providing low-cost prototyping, volume production and system integration of electronic assemblies.

More than 500 IC projects tape-out a year. Co-work with more than 300 companies and more than 700 universities.

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Woodcliff Lake, NJ — October 8, 2026 —Semiconductor intellectual property provider CAST ...
Espoo, Finland – October 5, 2026 – Xiphera announces the launch of ...
WASHINGTON, Oct. 5, 2026 – The Semiconductor Industry Association (SIA) today announced ...
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Advanced packaging has become the place where AI system performance ...
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