SANTA CLARA, Calif.– April 23, 205 –TSMC (TWSE: 2330, NYSE: TSM) today unveiled its next cutting-edge logic process technology, A14, at the Company’s North America Technology Symposium. Representing a significant advancement from TSMC’s industry-leading N2 process, A14 is designed to drive AI transformation forward by delivering faster computing and greater power
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April 23, 2025 — KeyASIC, a leading publicly listed ASIC design services company, today announced a partnership with AnySilicon, the premier platform connecting companies with IP cores and ASIC service providers. This collaboration will significantly expand KeyASIC’s marketing reach, providing access to AnySilicon’s extensive network of potential customers actively seeking ASIC
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In the realm of cutting-edge electronics, the shift from silicon-based components to gallium nitride (GaN) technology is making waves across industries. As traditional semiconductors reach their performance limits, GaN High Electron Mobility Transistors (HEMTs) offer a compelling alternative with superior efficiency and enhanced thermal management. Whether you’re an engineer diving
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In the rapidly evolving landscape of electronic design, ensuring that complex mixed-signal designs function correctly is more critical than ever. Mixed-signal verification, or AMS verification, lies at the heart of this challenge, bridging the gap between analog and digital designs in an increasingly digital world. As these technologies become more
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Hsinchu, Taiwan, R.O.C., April 17, 2025 — TSMC today announced consolidated revenue of NT$839.25 billion, net income of NT$361.56 billion, and diluted earnings per share of NT$13.94
(US$2.12 per ADR unit) for the first quarter ended March 31, 2025. Year-over-year, first quarter revenue increased 41.6%, while net income and diluted
The DFN (Dual Flat No-leads) and its counterpart, the QFN (Quad Flat No-leads), are increasingly prevalent in high-performance applications. They’re favored for applications ranging from consumer electronics to automotive systems due to their ability to support advanced circuitry in a small footprint. Familiarizing yourself with these packages’ specifications can dramatically
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