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VeriSilicon partners with LVGL to enable advanced GPU acceleration for wearable devices and beyond

press release

Shanghai, China – November 29, 2024–VeriSilicon (688521.SH) today announced a strategic partnership with LVGL, the leading open-source graphics library for embedded systems, to support VeriSilicon’s low-power 3D and VGLite 2.5D GPU technology within the LVGL library. This partnership aims to optimize performance and expand graphic processing capabilities for a wide

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GlobalFoundries Secures $1.5 Billion in CHIPS Act Funding to Expand US Semiconductor Production

GlobalFoundries (GF), a leading semiconductor manufacturer, has been awarded up to $1.5 billion in funding under the US CHIPS and Science Act. This significant investment, part of GF’s larger $13 billion plan to expand its US production capacity over the next decade, will bolster domestic chip production and address critical

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Sam Altman’s Rain AI: A New Contender in the High-Stakes AI Chip Race

BGA

OpenAI CEO Sam Altman is leading a $150 million funding round for Rain AI, a semiconductor startup aiming to rival Nvidia’s dominance in the AI chip market. This investment, valuing Rain AI at $600 million, follows a $25 million seed round in 2022 where Altman was a major investor. Rain

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Quantum-Si Expands Collaboration with SkyWater to Develop New Chip Production Process Critical for Groundbreaking New Proteomics Platform

BRANFORD, Conn. and BLOOMINGTON, Minn. – November 20, 2024 – Quantum-Si Incorporated (Nasdaq: QSI) (“Quantum-Si,” or “QSI”), The Protein Sequencing Company™ and SkyWater Technology (NASDAQ: SKYT), the trusted technology realization partner, announced today they will jointly expand their relationship to support the development of Proteus, Quantum-Si’s next-generation platform designed to transform proteomic research.

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Cadence Unveils Arm-Based System Chiplet

Cadence has announced a groundbreaking achievement with the development and successful tapeout of its first Arm-based system chiplet. This innovation marks a pivotal advancement in chiplet technology, showcasing Cadence’s commitment to driving industry-leading solutions through its chiplet architecture and framework.
 
The First System Chiplet
In a significant leap forward,

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Ultimate Guide: Embedded Non-Volatile Memory (eNVM)

Embedded non-volatile memories (eNVM) are memory blocks that are directly integrated semiconductor fabrication on the same die. Since eNVM memories are non-volatile, the data is retained even when the power is off. In addition, eNVMs are reprogrammable and erasable multiple times. Compared to external non-volatile memory technologies, eNVMs have lower

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