WLP will definitely be a winner by 2025, declared Yole Développement (Yole) in its new Advanced Packaging Quarterly Market Monitor. $2.5B will be the market figure to remember as it will be Fan-out (FO) package revenue by 2025. Behind this data, there is TSMC’s strategy to drive fan-out for 5G applications. In parallel,
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Over the past decade, the IC industry has been paring down its older capacity as manufacturers have consolidated or transitioned to the fab-lite or fabless business models. In its recently released Global Wafer Capacity 2020-2024 report, IC Insights shows that due to the surge of merger and acquisition activity in the middle
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This is a guest post by Stephen Crosher, CEO of Moortec
As we move in to 2020 it’s clear that every sector of industry, including the semiconductor industry, will have a responsibility to address growing environmental concerns. We should be aware that as our sector underpins the growth in
Regional marketshares of IDMs (companies operating wafer fabs), fabless companies, and total IC sales were led by U.S. headquartered companies in 2019, according to data presented in the recently released March Update to The McClean Report 2020.
Figure 1 shows U.S. companies held 55% of the total worldwide IC
Hsinchu, Taiwan (March 16, 2020) –eMemory, the world’s leading provider of intellectual property for non-volatile memory, today announced that its NeoMTP has been qualified on TSMC’s Third-Generation 0.18μm Bipolar-CMOS-DMOS (BCD) process to provide IoT power-management solutions and cost competitiveness.
eMemory’s NeoMTP is a popular choice for chip designers making
When mobile phones changed into smart phones a proximity (PS) and ambient light sensor (ALS) became an important sensor in every phone. Measurement of ambient light is used to adjust the screen backlight. The proximity sensor is used to detect a person holding to phone near the ear. While some
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