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2.5D Packaging: Ultimate Guide

Imagine a world where electronic devices are exponentially more powerful yet astonishingly compact. This is the promise of 2.5D packaging, an innovative approach to semiconductor design. It’s reshaping the landscape of computing, from smartphones to servers.
 

 
In the realm of electronics, understanding the building blocks is key.

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MosChip® Technologies joins Renesas RZ Partner Ecosystem as AI/ML Design Partner

[Santa Clara, USA], [October 21st, 2024] – MosChip® Technologies is now an AI/ML design partner under Renesas RZ partner ecosystems, delivering intelligent solutions based on Renesas RZ/V series of MPUs.
 
MosChip® Technologies is a semiconductor design and product engineering services company with expertise in SoC design, systems, software, mobility, connectivity,

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TSMC’s 2nm Process: Exceptional Demand Drives Capacity Expansion

wafer

Taiwan Semiconductor Manufacturing Company (TSMC) today announced that customer inquiries for its next-generation 2nm process are exceeding even those for its already successful 3nm technology. This exceptional demand underscores the industry’s confidence in TSMC’s technological leadership and its ability to meet the rapidly growing needs of the AI and high-performance

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Silicon IP Provider, Chips&Media Unveils New Multi Video Codec IP, WAVE6 Gen2+

press release

Seoul, South Korea, Oct 23, 2024—Chips&Media (C&M), a global leader in video codec IP and application-specific NPU IP, today announced the WAVE6 Gen2+ series, a new multi-standard video codec hardware IP based on the next-generation video codec IP platform WAVE6.
 
The WAVE6 Gen2+ series is a newly designed IP

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TSMC Q3 2024 Earnings: Strong Results Driven by AI Demand, but Challenges Remain

TSMC

October 17, 2024 – Taiwan Semiconductor Manufacturing Company (TSMC) today reported strong third-quarter 2024 earnings, exceeding guidance and fueled by robust demand for high-performance computing (HPC) chips, particularly in the artificial intelligence (AI) sector. However, the company also highlighted challenges related to inventory levels, rising costs, and the ramp-up of

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EnSilica – Design and Supply contract award for a controller ASIC for automotive and industrial markets

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October 17, 2024 — EnSilica, a leading chip maker of mixed signal ASICs (Application Specific Integrated Circuits), is pleased to announce that it has been awarded a design and supply contract for a mixed signal controller ASIC to be used in automotive and industrial motorised actuators. The European based client (the

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