Blog

Presto and T&W Engineering Announce Long-Term Partnership to Advance Wearable Brain Sensing

Meyreuil, France—November 2, 2023—Presto Engineering, a European leading expert in application-specific integrated circuit (ASIC) design and semiconductor engineering and production services, and T&W Engineering, the leading in-ear electroencephalogram (EEG) wearable device developer and provider of artificial intelligence (AI)-driven EEG reading services, today announced their collaboration to develop an ASIC for measuring

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Meet Chips&Media at CES 2024, Las Vegas

Chips&Media invites you to have business discussions for your future projects.
 
Chips&Media will arrange meetings at CES 2024, Las Vegas, from Jan. 9th to Jan. 12th in Encore at Wynn. Any customers or potential customers who want to learn more about Chips&Media’s products are welcome to book meetings.
 
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The growth of the SiP market is propelled by the trends in 5G, AI, HPC, autonomous driving, and IoT

The SiP market was worth US$21.2 billion in 2022 and is projected to reach US$33.8 billion by 2028, growing at an 8.1% CAGR. This growth is fueled by trends like heterogeneous integration, chiplet technology, package optimization, and cost-efficiency, particularly in 5G, AI, HPC, autonomous driving, and IoT sectors. Yole Group’s

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MosChip Technologies announces its new Managing Director & CEO

Hyderabad, October 26, 2023 — MosChip Technologies Limited is pleased to announce the appointment of Mr. Srinivasa Rao Kakumanu, commonly referred to as “KS,” as the new Chief Executive Officer (CEO) and Managing Director (MD). KS, with an extensive background in the Semiconductor and Embedded industry spanning nearly 30 years, brings

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Sofics releases its ESD technology on TSMC 3nm process

news

Belgium, October 24, 2023 – Sofics bv, a leading semiconductor integrated circuit IP provider announced that its TakeCharge® Electrostatic Discharge (ESD) solutions portfolio is now available for TSMC’s advanced 3nm process technology.
 
Interface ESD protection in the most advanced FinFET technology is challenging: ESD sensitivity is very high while

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Green Mountain Semiconductor Inc. awarded a contract from NASA to Pave the Way for Space-Ready Neural Processors

press release

BURLINGTON, VT–Green Mountain Semiconductor Inc. (GMS), a custom circuit design provider, is proud to announce its recent achievement of a Phase I Small Business Innovation Research (SBIR) contract. This significant milestone underscores GMS’ commitment to pushing the boundaries of technology in support of space applications. The contract was granted under

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