Blog

Amkor Technology to Acquire NANIUM

TEMPE, Ariz. and VILA DO CONDE, Porto, Portugal, February 2, 2017 – Amkor Technology, Inc. (Nasdaq: AMKR) and NANIUM S.A. today announced that they have entered into a definitive agreement for Amkor to acquire NANIUM, a world class provider of wafer-level fan-out (WLFO) semiconductor packaging solutions. Terms of the transaction

Aquantia Announces the Industry’s First FPGA-Programmable Multi-Gigabit Ethernet PHY Device

Aquantia Corp., a pioneer and market leader in high-speed Ethernet connectivity solutions for data centers, enterprise infrastructure and client connectivity, today announced the AQcite product line of FPGA-programmable Multi-Gigabit Ethernet Physical Layer (PHY) devices, integrating Aquantia’s AQrate BASE-T PHY with a Xilinx® Kintex®-7 FPGA. The new AQcite product line targets

AnySilicon Offers Instant Price Quotes From ASIC Vendors

AnySilicon, the fast-growing semiconductor marketplace has announced today the availability of a new service allowing decision makers to receive instant price proposals from ASIC Design Companies, Semiconductor Foundries, Assembly and Test companies, and IP Core Vendors.
 

 
AnySilicon new service allows companies to easily receive price quotes and evaluate

Sonics Collaborates with GLOBALFOUNDRIES to Accelerate Adoption of Power and Performance Capabilities of the 22FDX® Process by SoC Designers

San Jose, Calif. – January 25, 2017 – Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) and power management technologies and services, today announced it will collaborate with GLOBALFOUNDRIES on energy processing unit (EPU) product development that leverages the power and performance optimization capabilities of the 22FDX® process

The Ultimate Guide to Wafer Sort

You may have heard of wafer sort or wafer testing, which is a part of the testing process performed on silicon wafers. Wafer sort is a simple electrical test, that is perform on a silicon die while it’s in a wafer form. Wafer sort’s main purpose is to identify the

Dolphin Integration Receives Open-Silicon’s Award for the Emerging IP Partner of the Year 2016 in the Low Power IoT Ecosystem

The industry’s focus on battery-powered devices sets new expectations in terms of energy saving for a wide range of applications such as IoT, wearables and wireless MCUs. Meeting the underlying low-power challenge requires a new class of silicon IPs to enable unmatched power consumption figures and new IoT SoC architectures