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Taiwan chipmaker UMC launches US$5 billion wafer fab facility in Singapore; 700 jobs to be created

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April-1, 2025 — United Microelectronics Corporation (UMC), a leading global semiconductor foundry, today announced the official opening of its new 22nm wafer fabrication facility (fab) in Singapore’s Pasir Ris Wafer Fab Park. The grand opening ceremony was attended by high-ranking Singaporean officials, including Deputy Prime Minister Gan Kim Yong and

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The Future of Semiconductors: A Deep Dive with Bill Finch (CAST)

Deep Dive Interview

This interview features Bill Finch, Senior Vice President,  CAST (Computer-Aided Software Technology Inc.)
 
Can you describe your company’s founding vision and how it has evolved to address the changing landscape of the semiconductor industry?
 
CAST was founded in the early 1990s by a group of EDA veterans who

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Faraday Technology Selects Silvaco FlexCAN IP for Advanced Automotive ASIC Design

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SANTA CLARA, Calif. — (BUSINESS WIRE) — March 24, 2025 — Silvaco Group, Inc. (Nasdaq: SVCO) (“Silvaco” or the “Company”), a provider of TCAD, EDA software, and SIP solutions that enable innovative semiconductor design and digital twin modeling through AI software and automation, today announced that Faraday Technology Corporation (TWSE: 3035) a leading provider

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Power Semiconductor Giants amid Struggles: 8,800+ Layoffs as Market Slows and China Emerges

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TrendForce, March 26, 2025 — Once a rising star alongside AI chips, power semiconductors are now feeling the heat from a sluggish EV market. According to ijiwei, citing Nikkei, major players are slashing jobs and pushing back investments, with layoffs topping 8,800.
 
Power semiconductors, vital for EV range and home

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FuriosaAI Rejects $800 Million Acquisition Offer from Meta, Opts for Independent Growth

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SEOUL, SOUTH KOREA – March 25, 2025 – South Korean AI chip startup FuriosaAI has declined an $800 million acquisition offer from US tech giant Meta, choosing instead to pursue its vision as an independent company
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Discussions between FuriosaAI and Meta had been ongoing since early this year, with

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Sarcina Technology launches AI platform To enable cost-effective customizable packaging solutions for AI applications

Sarcina Technology semiconductor packaging platform PR image

Palo Alto, CA – 25 March 2025. Sarcina Technology, a global semiconductor packaging specialist, is excited to announce the launch of its innovative AI platform to enable advanced AI packaging solutions that can be tailored to meet specific customer requirements. Leveraging ASE’s FOCoS-CL (Fan-Out Chip-on-Substrate-Chip Last) assembly technology, this platform

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