PENANG, Malaysia , Dec. 19, 2024 — SignOff Semiconductors Pvt. Ltd., headquartered in Bengaluru, India, and a leading provider of VLSI and Embedded Design services, is thrilled to announce the opening of its new office in Penang, Malaysia. This expansion enables the company to meet the growing demand for semiconductor chip design services from Fortune 500 companies operating in and expanding within Penang. It also aligns perfectly with the Malaysian government’s vision
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SAN RAMON, CA, UNITED STATES, February 19, 2025 — YorChip, Inc. in collaboration with its design partner SiliconIPs announces development of a 50nS latency 100G Ultra Ethernet ready Mac/PCS IP core. The IP is optimized for size, power and latency and targets edge AI applications as well as Data Center Accelerator
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CAMPBELL, Calif., February 18, 2025 – Arteris, Inc. (Nasdaq: AIP), a leading provider of system IP which accelerates system-on-chip (SoC) creation, today introduced FlexGen, a revolutionary, smart network-on-chip (NoC) interconnect IP. FlexGen from Arteris dramatically accelerates chip development while optimizing performance efficiency, addressing the rising demand for faster, more sustainable innovation
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BAYAN LEPAS, Malaysia, February 18, 2025–ASE has officially launched its fifth plant in Penang, which will significantly build on the company’s strong packaging and testing capabilities in the Bayan Lepas Free Industrial Zone. The new plant is part of a strategic expansion plan that will expand the floor space of
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The accompanying table provides a summary of the full-year 2024 performance, including revenue (in USD billions), year-over-year (YoY) growth, and relevant notes for each company. Below are some highlights from the individual company reports:
TSMC: The world’s leading foundry, TSMC, continued its strong performance, reporting exceptional growth. While specific
OpenAI, the maker of ChatGPT, is set to finalize its first in-house AI chip design in the coming months, taking a key step toward reducing its reliance on NVIDIA. According to Reuters, the company is expected to send the chips to TSMC for fabrication soon as it aims for mass
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