“The semiconductor industry is facing a new era in which device scaling and cost reduction will not continue on the path they followed for the past few decades, with Moore’s law in its foundation”, asserts Andrej Ivankovic, Technology & Market Analyst, in the Advanced Packaging and Semiconductor Manufacturing team, at Yole Développement
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Lidless BGA package essentially offers one main advantage compared to a heatspreader-BGA packages: better thermal performance. The second advantage of the lidless BGA is lower cost due to the fact that a heatspreader is not used in lidless BGA configuration. This article will cover the thermal properties of the lidless
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Within the second half 2015 China Jianguang will complete the acquisition of NXP’s RF Power Unit for $1.8B. For some analysts this was a necessary strategic step as a result of the acquisition of FreeScale Semiconductor that has as well a similar unit.
The buyer is Jianguang Asset Management
Avago Technologies , the Singaporean chipmaker that started out as a division of Hewlett Packard (HP), is in advanced negotiations to acquire American chip manufacturer Broadcom, which makes chips for about half tablet computers and smartphones worldwide, its customers include Amazon, Apple, Google and Samsung , reported the newspaper “Wall
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Palomar/Hughes started designing and manufacturing wedge bonders in the early 1980s for the aerospace and defense industries. Later, these machines were used for a wider array of applications beyond just military, including medical devices, RF/Wireless packages, automotive sensor systems, and optoelectronic systems and components. Ultrasonic wedge bonding was introduced in the early
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70 % of ASIC design goes in verification and 70 % of verification goes in debugging.
Planning for the debugging goes a long way. Feature by feature the way we architect the test bench pay some attention as to how will it be debugged. This strategy will pay back