The name leadframe (or lead-frame) is actually very accurate.
Leadframe is an alloy frame that consists of the package leads and the paddle. The silicon die is attached on the paddle and the leads are connected to the die with wirebonds. That’s it.
In the above
Early on in Chip projects, yield is not taken very seriously. The common thinking goes – anyhow there isn’t much to do as this early point of time. However, there are actually several things you can do even before the Chip design starts, which will translate to clear savings.
1-
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HTOL (High Temperature Operating Life) testing is a stress test defined by JEDEC to define the reliability of IC products, and is an essential part of ASIC qualification tests. This post provides a high-level overview of HTOL test. Obviously, you should refer to the standard if you plan to perform
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Semiconductor Assembly and Test Services are converting rapidly into a pure outsourcing mode of operation. While today perhaps only 50% of the market is using Outsourced Semiconductor Assembly and Test (OSAT, or SATS) this number is set to increase in the future.
While many of the low-end suppliers are
QFN package is probably the most successful package type today. Offering low price, excellent performance and small size, it is an ideal package for many applications.
QFN (quad-flat no-leads) is a plastic SMT package consisting of: a leadframe, single or multiple dies, wirebonds and a molding compound. The
There are many ways to deliver, package and transport silicon products. Here’s a short primer that provides the basic facts regarding how silicon can be packed and delivered to ensure safe transportation with minimum damages.
There are two main options for receiving wafers from your foundry: tested or untested.
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