Blog

Cadence to Acquire Secure-IC, a Leader in Embedded Security IP

SAN JOSE, Calif.— January 21, 2025 — Cadence (Nasdaq: CDNS) today announced it has entered into a definitive agreement to acquire Secure-IC, a leading embedded security IP platform provider. The addition of Secure-IC’s talent and highly complementary, proven portfolio of embedded security IP, security solutions, security evaluation tools and services will

Understanding Multi Chip Module (MCM)

Multi Chip Modules (MCM) have emerged as a game-changing solution. As consumer demand for faster, more powerful electronics increases, traditional chip designs can no longer meet the growing need for performance and space-saving designs. MCMs offer a sophisticated approach to semiconductor architecture by integrating multiple chips into a single package.
Read More

Understanding Heterogeneous Integration (HI)

Heterogeneous integration offers a solution by allowing different materials and components to work together seamlessly, driving innovation in various applications. This approach not only enhances system performance but also enables the development of sophisticated electronic devices that are smaller, faster, and more efficient.
 
Understanding heterogeneous integration requires a grasp

Micross Acquires Integra Technologies, Creating the Leading U.S. Domiciled OSAT Provider

MELVILLE, N.Y., Jan. 15, 2025 /PRNewswire/ — Micross Components, Inc. (“Micross” or the “Company”), a leading provider of high-reliability microelectronic product and service solutions for aerospace, defense, space, medical and industrial applications and a portfolio company of Behrman Capital, today closed the acquisition of Integra Technologies (“Integra”). Integra is an Outsourced Semiconductor

onsemi Acquires Silicon Carbide JFET Technology to Enhance Its Power Portfolio for AI Data Centers

SCOTTSDALE, Ariz. – Dec. 9, 2024 – onsemi (Nasdaq: ON) today announced that it has entered into an agreement to acquire the Silicon Carbide Junction Field-Effect Transistor (SiC JFET) technology business, including the United Silicon Carbide subsidiary, from Qorvo for $115 million in cash. The acquisition will complement onsemi’s extensive EliteSiC

Introduction to Chip Scale Packaging

Chip Scale Packaging (CSP) emerges as a groundbreaking solution that optimizes space while enhancing performance in the realm of microelectronics. This innovative packaging method is transforming how devices are designed and manufactured, impacting various industries.
 

 
Chip Scale Packaging is characterized by its compact size, which allows for