Taiwan Semiconductor Manufacturing Company (TSMC) today announced that customer inquiries for its next-generation 2nm process are exceeding even those for its already successful 3nm technology. This exceptional demand underscores the industry’s confidence in TSMC’s technological leadership and its ability to meet the rapidly growing needs of the AI and high-performance
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Seoul, South Korea, Oct 23, 2024—Chips&Media (C&M), a global leader in video codec IP and application-specific NPU IP, today announced the WAVE6 Gen2+ series, a new multi-standard video codec hardware IP based on the next-generation video codec IP platform WAVE6.
The WAVE6 Gen2+ series is a newly designed IP
October 17, 2024 – Taiwan Semiconductor Manufacturing Company (TSMC) today reported strong third-quarter 2024 earnings, exceeding guidance and fueled by robust demand for high-performance computing (HPC) chips, particularly in the artificial intelligence (AI) sector. However, the company also highlighted challenges related to inventory levels, rising costs, and the ramp-up of
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October 17, 2024 — EnSilica, a leading chip maker of mixed signal ASICs (Application Specific Integrated Circuits), is pleased to announce that it has been awarded a design and supply contract for a mixed signal controller ASIC to be used in automotive and industrial motorised actuators. The European based client (the
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October 15, 2024 – Xscape Photonics, a pioneer in next-generation data center connectivity, today announced the closing of a $44 million Series A funding round, bringing its total funding to $57 million. The round was led by IAG Capital Partners and included participation from Cisco Systems Inc., Nvidia Corp., Altair
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October 15, 2024 – CG Power and Industrial Solutions Limited, a Murugappa Group company, today announced the acquisition of Renesas Electronics Corporation’s radio frequency (RF) components business for USD 36 million. This strategic acquisition marks CG Power’s entry into the semiconductor design sector, a high-growth and high-profitability market.
The
