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Synopsys Collaborates with TSMC to Drive the Next Wave of AI and Multi-Die Innovation

Sept. 25, 2025 – 
SUNNYVALE, Calif. —   — Synopsys, Inc. (Nasdaq: SNPS) announced today its ongoing close collaboration with TSMC to deliver multi-die solutions, encompassing advanced EDA and IP products, that support TSMC’s leading-edge processes and packaging technologies, driving innovation in AI chip and multi-die design. The 3DIC Compiler exploration-to-signoff platform and IP, tuned for

proteanTecs Announces Silicon-Proven IP on TSMC’s Advanced N2P Process

proteanTecs®, a global leader in advanced analytics for semiconductor health and performance monitoring, today announced the successful silicon-proven validation of its innovative IP-based health and performance monitoring technology at TSMC’s industry-leading 2nm (N2P) process node. The company is a member of the TSMC IP Alliance Program, a key component of

Alphawave Semi Taped-Out Industry Leading 64Gbps UCIe™ IP on TSMC 3nm for the IP Ecosystem, Unleashing Next Generation of AI Chiplet Connectivity

LONDON & TORONTO, Sept. 24, 2025 – 

Alphawave Semi (LSE: AWE), a global leader in high-speed connectivity and compute silicon for the world’s technology infrastructure, today announced the successful tapeout of the industry’s leading 64 Gbps UCIe™ die-to-die (D2D) IP subsystem on TSMC’s 3nm process technology. Building on its 36

Arteris Selected by NanoXplore for Space Applications

Sept. 24, 2025 –  CAMPBELL, Calif. –  Arteris, Inc. (Nasdaq: AIP), a leading provider of system IP for accelerating semiconductor creation, today announced that NanoXplore, a French provider of radiation-hardened system-on-chip (SoC) FPGA technology, has licensed Arteris’ FlexGen smart NoC IP for its space designs. FlexGen will be used in the development

EnSilica and Codasip announce strategic partnership

Sept. 23, 2025 – 
EnSilica and Codasip announce strategic partnership to bring CHERI cybersecurity to automotive, critical national infrastructure, defence and aerospace applications
 
Oxfordshire, United Kingdom and Munich, Germany –  EnSilica, a fabless supplier of mixed-signal and digital ASICs, and Codasip, a provider of functionally-safe and cyber-resilient RISC-V CPUs, announces

Silicon Creations Announces 1000th Production FinFET Tapeout at TSMC and Immediate Availability of Full IP Library on TSMC N2 Technology

Lawrenceville, GA , Sept. 18, 2025 –  Silicon Creations, a leading provider of precision IP for advanced SoC design, today announced its 1000th production FinFET tapeout at TSMC, alongside the immediate availability of a comprehensive library of IP on TSMC’s advanced N2P process node. The N2P offering includes a full suite of PLLs and clocking IP, such as free-running