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Cadence Unveils Arm-Based System Chiplet

Cadence has announced a groundbreaking achievement with the development and successful tapeout of its first Arm-based system chiplet. This innovation marks a pivotal advancement in chiplet technology, showcasing Cadence’s commitment to driving industry-leading solutions through its chiplet architecture and framework.
 
The First System Chiplet
In a significant leap forward,

Ultimate Guide: Embedded Non-Volatile Memory (eNVM)

Embedded non-volatile memories (eNVM) are memory blocks that are directly integrated semiconductor fabrication on the same die. Since eNVM memories are non-volatile, the data is retained even when the power is off. In addition, eNVMs are reprogrammable and erasable multiple times. Compared to external non-volatile memory technologies, eNVMs have lower

Tower Semiconductor Reports Strong Third Quarter Results and Announces Major Capacity Expansion Plan

Migdal Haemek, Israel – November 13, 2024 – Tower Semiconductor (NASDAQ: TSEM & TASE: TSEM) today announced its financial results for the third quarter ended September 30, 2024, reporting continued growth and a significant investment in future capacity.
 
Third Quarter Highlights:

Revenue reached $371 million, a 6% increase

CAST Adds New SafeSPI Controller to its Functional Safety IP Core Product Line

Woodcliff Lake, New Jersey — November 19, 2024—Semiconductor intellectual property provider CAST, in collaboration with Silesia Devices, today announced a new IP core that implements the Serial Peripheral Interface for Automotive Safety (SafeSPI), an emerging open standard that adds Functional Safety and interoperability features to the de-facto Serial Peripheral Interface

The Ultimate Guide to Gate-All-Around (GAA)

Introduction to Gate-All-Around (GAA) Transistors
Gate-all-around (GAA) transistors are a newly introduced type of transistor structure: the gate terminal connects with the channel on all sides. Gate-All-Around transistors are a multi-gate field effect transistors type where a silicon nanowire gate moves around the channel by further scaling down FinFET. The

Japan to roll out $65bn in support for chips, AI

[Nov 12, 2024] – Japanese Prime Minister Shigeru Ishiba today announced a substantial new investment plan totaling over JPY10 trillion (approximately US$87 billion) for the nation’s semiconductor and artificial intelligence industries by fiscal year 2030. This ambitious initiative aims to stimulate a total of JPY50 trillion (approximately US$346 billion) in