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X-FAB First Quarter 2025 Results

April 29-2025 — TESSENDERLO-HAM, Belgium-Regulatory News:
X-FAB (BOURSE:XFAB):
 
Highlights Q1 2025:

Revenue was USD 204.1 million, down 6% year-on-year (YoY) and up 8% quarter-on-quarter (QoQ)
Excluding the impact from revenue recognized over time (IFRS 15), revenue was USD 202.3 million, well within the guided range of USD 195-205 million
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STMicroelectronics Published Q1 2025 Financial Results

STMicroelectronics has announced its financial results for the first quarter of 2025, reflecting both the challenges of a shifting market and the company’s strategic transformation efforts.

 
This memo summarizes STMicroelectronics’ Q1 2025 financial results, as announced. While revenues were down 27.3% year-over-year to $2.52 billion, aligning with

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Intel Expands Foundry Ecosystem With TSMC, UMC, and Taiwanese IP Partners

Intel’s new CEO, Lip-Bu Tan, concluded his first earnings call, signaling a strong commitment to the company’s transformation. This transformation includes a strategic blend of internal manufacturing and external partnerships, notably with TSMC. Intel’s upcoming Nova Lake CPU will leverage both Intel’s own fabs and TSMC’s manufacturing capabilities, optimizing production

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The Future of Semiconductors: A Deep Dive with Scott Bulbrook

This interview features Scott Bulbrook, President of DA-Integrated.
 

 
Can you describe your company’s founding vision and how it has evolved to address the changing landscape of the semiconductor industry?
 
DA-Integrated was founded to address a gap in the industry concerning the availability of test development services

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New Audio Sample Rate Converter (ASRC) IP Core from CAST Offers Versatility with High Fidelity

press release

Woodcliff Lake, New Jersey — April 29, 2025 — Semiconductor intellectual property core provider CAST today introduced a high-performance Audio Sample Rate Converter (ASRC) IP core that delivers real-time and batch-mode sample rate conversion with exceptional signal integrity, ultra-low distortion, and unmatched scalability. The company believes the new Audio Sample

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UCIe™ — Universal Chiplet Interconnect Express

chiplet

UCIe, is a pivotal player in modern chip design that places emphatic power on high-bandwidth data transfer, efficient heat management, and reduced leakage. This standard features bioinspired advancements, system co-optimization, and integration with cutting-edge 3D packaging, which together revolutionize AI, high-performance computing, and consumer electronics. Alongside optical I/O advancements, UCIe

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