WASHINGTON—Sept. 3, 2024—The Semiconductor Industry Association (SIA) today announced global semiconductor industry sales hit $51.3 billion during the month of July 2024, an increase of 18.7% compared to the July 2023 total of $43.2 billion and 2.7% more than the June 2024 total of $50.0 billion. Monthly sales are compiled
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Meyreuil, France—September 3, 2024— CoreHW, a leading fabless semiconductor company, and Presto Engineering, a European expert in application specific integrated circuit (ASIC) design, engineering, and production services, have announced their successful collaboration in developing the first enhanced low-power radio frequency (RF) 2.4GHz front-end module in an ultra-small and thin wafer-scale
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3-Sep-2024: The Netherlands is poised to restrict ASML’s ability to service its advanced wafer fab equipment in China, according to Bloomberg. This move could significantly hinder China’s semiconductor ambitions, potentially impacting the production capabilities of SMIC, China’s leading chipmaker.
The Dutch government plans to let certain licenses expire at
Sep. 2, 2024 —- TrendForce’s latest investigations have found that the arrival of China’s 618 mid-year shopping season as well as inventory levels of consumer electronics reaching healthier levels, have prompted customers to begin restocking components, resulting in urgent orders for wafer foundries. This surge in demand has significantly improved capacity
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A new analysis by TechanaLye, a semiconductor research company, reveals that China’s semiconductor industry is rapidly advancing, with its leading chipmaker, Semiconductor Manufacturing International Corp. (SMIC), producing 7-nanometer chips that rival the performance of Taiwan Semiconductor Manufacturing Co.’s (TSMC) 5-nanometer chips.
The analysis, conducted by TechanaLye CEO Hiroharu Shimizu,
Aug-27th 2024, the Biden-Harris Administration announced that the Department of Commerce and HP Inc. have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $50 million in proposed direct funding under the CHIPS and Science Act. The proposed funding would support the expansion and modernization of HP’s
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