Focused Ion Beam (FIB) technology is one of the most versatile tools used in semiconductor failure analysis and microelectronics characterization. A FIB system directs a tightly focused beam of ions onto a sample. By controlling the beam current, energy, position and scanning pattern, engineers can remove material from extremely specific locations,
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The Human Body Model (HBM) Electrostatic Discharge (ESD) test is the oldest and most widely used ESD test in the electronics industry. The JEDEC HBM test isn’t static; it has been revised to keep up with the rapid changes in the semiconductor industry. The latest revision of the spec addresses failures
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Designing an ASIC/Chip is a complex engineering challenge that requires careful planning and accurate estimation of the final chip size. As process nodes continue to shrink and foundry technologies diversify, having a reliable chip size calculator can save time, reduce risk, and streamline the design process. Our free online ASIC
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