Category Archives: ASIC Design

Key ASIC Berhad Signs RM1.11 Million Contract to Jointly Develop AI-Driven, Ultra-Low Power RF Navigation Chip with Middle East Partner

press release chip

Kuala Lumpur, Malaysia – September 30, 2025 – Key ASIC Berhad (“Key ASIC” or “the Company”), a leader in ASIC design and innovation, has signed a contract worth RM1.11 million with a navigation systems company in the Middle East to jointly develop an AI-driven RF-integrated navigation chip.
 
 
The

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The 3 Hidden Risks That Can Derail Your IC Design Project! How to Avoid Them?

CPU chip installed on a computer motherboard

As more companies pursue ASICs to gain product-level differentiation, the ASIC road from concept to chip is paved with unseen challenges.
Many design teams, especially startups or system OEMs new to silicon, encounter the same pitfalls that delay projects, drain budgets, or derail product timelines.
 
Based on our experience

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Synopsys Collaborates with TSMC to Drive the Next Wave of AI and Multi-Die Innovation

press release wafer

Sept. 25, 2025 – 
SUNNYVALE, Calif. —   — Synopsys, Inc. (Nasdaq: SNPS) announced today its ongoing close collaboration with TSMC to deliver multi-die solutions, encompassing advanced EDA and IP products, that support TSMC’s leading-edge processes and packaging technologies, driving innovation in AI chip and multi-die design. The 3DIC Compiler exploration-to-signoff platform and IP, tuned for

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EnSilica and Codasip announce strategic partnership

news

Sept. 23, 2025 – 
EnSilica and Codasip announce strategic partnership to bring CHERI cybersecurity to automotive, critical national infrastructure, defence and aerospace applications
 
Oxfordshire, United Kingdom and Munich, Germany –  EnSilica, a fabless supplier of mixed-signal and digital ASICs, and Codasip, a provider of functionally-safe and cyber-resilient RISC-V CPUs, announces

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The Future of Semiconductors: A Deep Dive with Srinivasa Rao Kakumanu

This interview features Srinivasa Rao Kakumanu, CEO & MD of MosChip.
 

 
About Srinivasa Rao Kakumanu
 
Mr. Srinivasa Kakumanu, commonly known as “KS,” possesses an extensive professional background spanning over 28 years within the Semiconductor industry. His notable accomplishments include the co-founding of First Pass Semiconductors Pvt

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Synopsys Announces Expanding AI Capabilities for its Leading EDA Solutions

Press Release PR

SUNNYVALE, Calif., Sept. 3, 2025 — Today Synopsys (Nasdaq: SNPS) announced expanding Synopsys.ai™ Copilot generative AI (GenAI) capabilities for its industry-leading semiconductor design solutions, enabling semiconductor engineering teams to accelerate development timelines, support significantly more complex designs, and increase engineering velocity amidst a workforce shortage.
 

 

Synopsys pioneered AI as a

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