Category Archives: ASIC Design

Cyient Announces the Launch of Semiconductor Subsidiary

press release gpt

Mumbai, India, April 8, 2025 — Cyient, a leading global engineering and technology solutions company, announced the launch of its fully owned semiconductor subsidiary, Cyient Semiconductors. This strategic move strengthens the company’s commitment to innovation and excellence across the global semiconductor landscape.
 
By carrying forward Cyient’s expertise in semiconductor

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HCLTech joins Samsung SAFE™ Program as a Design Solution Partner

india flag wafer

NOIDA, India, Mar 27, 2025—HCLTech, a leading global technology company, has been selected as a Design Solution Partner (DSP) under the Samsung Advanced Foundry Ecosystem (SAFE™) program. This strategic partnership between HCLTech and Samsung is set to accelerate semiconductor innovation and development, leveraging HCLTech’s extensive expertise in Engineering and R&D

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imec to set up €40m chiplet development centre in Germany

chiplet

April-1, 2025 — imec, a world-leading research and innovation center in nanoelectronics and digital technologies, today announced the establishment of its Advanced Chip Design Accelerator (ACDA) in Baden-Württemberg, Germany. This €40 million center, funded over the next five years, will focus on accelerating the development and adoption of automotive chiplet technology,

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Faraday Technology Selects Silvaco FlexCAN IP for Advanced Automotive ASIC Design

car

SANTA CLARA, Calif. — (BUSINESS WIRE) — March 24, 2025 — Silvaco Group, Inc. (Nasdaq: SVCO) (“Silvaco” or the “Company”), a provider of TCAD, EDA software, and SIP solutions that enable innovative semiconductor design and digital twin modeling through AI software and automation, today announced that Faraday Technology Corporation (TWSE: 3035) a leading provider

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Zero ASIC launches world’s first open standard eFPGA product

press release gpt

Cambridge, MA – March 18, 2025 – Zero ASIC, a U.S. semiconductor startup on a mission to democratize silicon, has announced PlatypusTM, the world’s first open-standard eFPGA IP product. Platypus is the FIRST and ONLY commercial eFPGA IP products with:
 

100% open and standardized FPGA architectures
100% open source

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EnSilica Secures €2.13 Million European Space Agency Development Contract

Launch.

March 6, 2025 – EnSilica plc (AIM:ENSI), a leading chip maker of mixed signal ASICs (“Application Specific Integrated Circuits”), is pleased to announce that it has been awarded a €2.13 million development contract under the European Space Agency’s (“ESA”) Navigation Innovation and Support Programme (“NAVISP”) Element 2 (the “Project”).
 
Under

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