Category Archives: Blog

After 2Q19 Bottom, Expectations Increase for a 3Q19 IC Market Rebound

May 22, 2019, anysilicon

IC Insights will release its May Update to the 2019 McClean Report later this month.  This Updateincludes a discussion of the 1Q19 IC industry market results, a detailed quarterly IC market forecast for the remainder of this year, and a look at the top-25 1Q19 semiconductor suppliers.
Over its 60-year history, the IC industry is

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History and Milestones of TSMC

May 11, 2019, anysilicon

TSMC stands for Taiwan Semiconductor Manufacturing Company. TSMC, with its headquarters and primary operations located in Hsinchu Science Park in Taiwan, is the largest independent semiconductor foundry worldwide — making it a centerpiece in the world of fabless silicon manufacturing.
One cannot tell the story of TSMC without telling

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Semiconductor Wafer Capacity Per Region

February 18, 2019, anysilicon

IC Insights recently released its new Global Wafer Capacity 2019-2023 report that provides in-depth detail, analyses, and forecasts for IC industry capacity by wafer size, process geometry, region, and product type through 2023.  Figure 1 shows the world’s installed monthly wafer production capacity by geographic region (or country) as of December

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Lekha Wireless appoints T2M for global marketing, representation and business development

August 07, 2018, anysilicon

Lekha Wireless, the leading wireless communications and embedded systems technology company, has signed an agreement with T2M, the world’s largest independent global semiconductor IP provider, to act as a global representative and business development partner of Lekha Wireless’ IP and technology solutions.
Lekha Wireless has a wide range of

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Amkor Delivers Industry’s First Package Assembly Design Kit to Support Mentor’s High-Density Advanced Packaging Tools

July 21, 2018, anysilicon

Amkor Technology announced today it has partnered with Mentor to release Amkor’s SmartPackage™ Package Assembly Design Kit (PADK), the first in the industry to support Mentor’s High-Density Advanced Packaging (HDAP) design process and tools. Amkor’s award-winning High-Density Fan Out(HDFO) process can now be used in conjunction with Mentor’s software to deliver

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HDL Design House and Mentor Workshop at Aviation Electronics Europe 2018

May 24, 2018, anysilicon

HDL Design House, provider of digital, analog, and back-end design and verification services and products in numerous areas of SoC, will host a joint technical workshop with Mentor, a Siemens business, at the Aviation Electronics Europe conference on June 19th, 2018 at the MOC Event Center in Munich, at 4pm.

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