Category Archives: Blog

Semiconductor Wafer Capacity Per Region

February 18, 2019, anysilicon

IC Insights recently released its new Global Wafer Capacity 2019-2023 report that provides in-depth detail, analyses, and forecasts for IC industry capacity by wafer size, process geometry, region, and product type through 2023.  Figure 1 shows the world’s installed monthly wafer production capacity by geographic region (or country) as of December

Read More

Lekha Wireless appoints T2M for global marketing, representation and business development

August 07, 2018, anysilicon

Lekha Wireless, the leading wireless communications and embedded systems technology company, has signed an agreement with T2M, the world’s largest independent global semiconductor IP provider, to act as a global representative and business development partner of Lekha Wireless’ IP and technology solutions.
 
Lekha Wireless has a wide range of

Read More

Amkor Delivers Industry’s First Package Assembly Design Kit to Support Mentor’s High-Density Advanced Packaging Tools

July 21, 2018, anysilicon

Amkor Technology announced today it has partnered with Mentor to release Amkor’s SmartPackage™ Package Assembly Design Kit (PADK), the first in the industry to support Mentor’s High-Density Advanced Packaging (HDAP) design process and tools. Amkor’s award-winning High-Density Fan Out(HDFO) process can now be used in conjunction with Mentor’s software to deliver

Read More

HDL Design House and Mentor Workshop at Aviation Electronics Europe 2018

May 24, 2018, anysilicon

HDL Design House, provider of digital, analog, and back-end design and verification services and products in numerous areas of SoC, will host a joint technical workshop with Mentor, a Siemens business, at the Aviation Electronics Europe conference on June 19th, 2018 at the MOC Event Center in Munich, at 4pm.

Read More

Dolphin Integration Joins GlobalFoundries FDXcelerator™ Program to Provide Breakthrough Fabric IP

October 17, 2017, anysilicon

Energy management is at the heart of the new generation of systems-on-chips (SoCs) targeting battery-powered applications. More complex power architectures are required to enable devices to run on the same battery for years rather than months. These new architectures often result in new noise challenges.
 
To deal with the

Read More

Rohde & Schwarz America and DA-Integrated Collaborate on IC Tester for Advanced RF & Millimeter Wave Integrated Circuits

May 17, 2017, anysilicon

COLUMBIA, Md., May 9, 2017 /PRNewswire/ — Rohde & Schwarz America (RSA), a leading supplier of test & measurement equipment, and DA-Integrated, a company that offers advanced production test systems for development, characterization and volume production, have announced today that they have collaborated to develop an on-wafer RFIC production test

Read More