Oct. 06, 2025 – Kaiserslautern, Germany — Creonic GmbH, a leading provider of ready-for-use IP cores for communication systems, announces the update of its Doppler Channel emulation IP core. The update introduces significant enhancements that increase flexibility and precision in satellite communication simulations.
The model now supports a wide range of satellite frequency
HOD HASHARON, Israel, Oct. 05, 2025 (GLOBE NEWSWIRE) — Weebit Nano Limited (ASX:WBT) (Weebit), a leading developer and licensor of advanced memory technologies for the global semiconductor industry, has successfully taped-out (released to manufacturing) test chips featuring its embedded Resistive Random-Access Memory (ReRAM) module at onsemi’s 300mm production fab in East Fishkill,
Read MorePORTLAND, October 1, 2025 — Analogue Insight IP Group today announced the opening of Analogue Insight SAFE in Oregon, a new U.S. venture dedicated to developing and licensing high-assurance security IP for next-generation secure Systems-on-Chip (SoCs) and chiplet-based architectures. The new US entity will be led by Rachael J. Parker and David Johnston, expanding
Read MoreWoodcliff Lake, New Jersey — September 30, 2025 — Semiconductor intellectual property (IP) provider CAST today announced the availability of a new SM4 Cipher IP Core, delivering compact, high-performance hardware implementations of the SM4 symmetric block cipher for both ASIC and FPGA designs.
SM4 is the Chinese national standard block cipher
proteanTecs®, a global leader in advanced analytics for semiconductor health and performance monitoring, today announced the successful silicon-proven validation of its innovative IP-based health and performance monitoring technology at TSMC’s industry-leading 2nm (N2P) process node. The company is a member of the TSMC IP Alliance Program, a key component of
Read MoreLONDON & TORONTO, Sept. 24, 2025 –
Alphawave Semi (LSE: AWE), a global leader in high-speed connectivity and compute silicon for the world’s technology infrastructure, today announced the successful tapeout of the industry’s leading 64 Gbps UCIe™ die-to-die (D2D) IP subsystem on TSMC’s 3nm process technology. Building on its 36
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