Category Archives: IP Cores

Leading the Charge: An Interview with Sofics’ Chief Engineering Olivier Marichal

Introduction
In the semiconductor industry, where the integration of cutting-edge technologies defines the next generation of electronics, Sofics is recognized for its innovation and reliability. With a portfolio that has empowered over 130 companies worldwide, Sofics’ IP solutions have become synonymous with performance, robustness, and efficiency.
 
At the heart

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New LZ4 & Snappy IP Core from CAST Enables Fast Lossless Data Decompression

news

Woodcliff Lake, New Jersey — June 4, 2024 — Semiconductor intellectual property provider CAST today announced a new IP core that implements a hardware decompression engine for the LZ4 and Snappy lossless data compression algorithms.
 
The new LZ4SNP-D LZ4/Snappy Data Decompressor IP core receives compressed data files, detects the

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Expedera Raises $20M Series B Funding Round Led By indie Semiconductor

press release

SANTA CLARA, Calif. — May 21, 2024— Expedera Inc., a leading licensor of edge inference artificial intelligence (AI) semiconductor intellectual property (IP), today announced it raised $20 million in Series B funding led by indie Semiconductor, with participation from prominent repeat and new industry investors. This investment, which includes converting

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Actions Technology’s smart watch SoC adopted VeriSilicon’s 2.5D GPU IP

news

Shanghai, China, May 15, 2024–VeriSilicon (688521.SH) today announced that Actions Technology (688049.SH), a low-power AIoT fabless semiconductor company, has adopted VeriSilicon’s power-efficient and feature-rich 2.5D Graphics Processor Unit (GPU) IP in its highly integrated dual-mode Bluetooth smart watch SoC series, ATS3085S and ATS3089.
 
Featuring low power consumption and high frame rate,

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Silvaco Announces Launch of Initial Public Offering

Santa Clara, CA – April 30, 2024 — Silvaco Group, Inc. (“Silvaco”), a provider of TCAD, EDA software, and SIP solutions that enable semiconductor design and AI through software and innovation, today announced it has launched the roadshow for its initial public offering (“IPO”) of 6,000,000 shares of its common stock.

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VeriSilicon’s complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification

press release

Shanghai, China, March 28, 2024 — VeriSilicon (688521.SH) today announced its complete Bluetooth Low Energy (BLE) IP solution has achieved full compliance with LE Audio specification, including certifications for the LE Audio protocol stack and Low Complexity Communications Codec (LC3). This solution is applicable to mobile phones, Bluetooth earphones including True

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