Moortec www.moortec.com, specialists in embedded in-chip subsystem solutions, are continuing their expansion with a move to a new UK Headquarters.
The new state of the art facility is located in the Plymouth Science Park which is the largest Science & Technology centre in the South West.
“The
Open-Silicon, a system-optimized ASIC solution provider, today announced it has successfully completed silicon validation of its High Bandwidth Memory (HBM2) IP subsystem in TSMC’s 16nm FinFET technology in combination with TSMC’s CoWoS® 2.5D silicon interposer technology and HBM2 memory. This full IP subsystem solution includes an HBM2 controller, PHY and
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Vidatronic, Inc. today announced the appointment of Avant Technology as the distributor of its proprietary power management Intellectual Property (IP) cores, products, and design services in Asian marketplaces, including representation in China, Taiwan, Korea, Japan, Malaysia, Vietnam and Singapore.
“With Avant as our distributor, we increase our presence in a
Moortec, providers of complete In-Chip Monitoring PVT Subsystems today announced that Cambricon have used Moortec’s 16FFC In-Chip Monitoring Subsystem IP in their artificial intelligence (AI) and machine learning chips.
“After a comprehensive investigation on almost all commercial solutions, we concluded that the PVT sensors from Moortec were the best
Moortec Semiconductor, specialists in embedded in-chip sensing, are pleased to announce the availability of their easy to integrate, embedded monitoring subsystem on TSMC’s 7nm FinFET (FF) process.
Within the subsystem the new 7nm Temperature Sensor is a high precision low power junction temperature sensor that has been developed to
Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced that the availability of its USB 3.1 PHY on UMC 28HPC process, as well as the silicon-verified USB 3.1 Type-C PHY with USB-PD 2.0 support on UMC 40LP process. Faraday introduced the industry’s first USB
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