Meyreuil, France and San Jose, Calif., June 24, 2021—Presto Engineering, an ASIC design and outsourced operations provider, and Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced a collaboration to broaden semiconductor package design solutions and expertise for high-performance system-in-package (SiP) development for the automotive and Industrial IoT markets. Presto is
Read More
Figure 1 – OSAT Offering by Application and by Types of Packaging
What is OSAT?
OSAT stands for Outsourced Semiconductor Assembly and Test. This is a third-party service that suppliers around the world offer, which consists, as the name implies, of semiconductor assembly, packaging and testing of
AnySilicon, the leading marketplace for semiconductor service providers, announced today that AEMTec, a leading packaging and assembly services provider, has joined AnySilicon to promote its services. As part of the AnySilicon platform, AEMTec will gain access to a full range of online marketing services to showcase its offering, increase exposure
Read MoreThe Qmode project is funded with an MIT-R&D collaboration project grant from the Provincie Overijssel, dedicated to stimulate the innovation and development of products, processes and services of local SMEs working in the Dutch Top Sectors. The collaboration established in Qmode will help QuiX secure a leading position in the
Read MoreTEMPE, Ariz., February 23, 2021 ― Amkor Technology, Inc. (Nasdaq: AMKR), a leader in advanced packaging technologies that support high-growth markets, including smartphones and 5G, advanced automotive systems, high-performance computing and consumer IoT, recently unveiled new measures that help the company achieve Industry 4.0 initiatives, extending its leadership in quality
Read MoreAEMtec GmbH located in Berlin Germany provides a new 2021 Eight Session Webinar Series “Next Level of Technology – High End Electronics meets Optics”. Launch of webinar series in February. New industry trends, technology portfolio, implementation strategies as well as already successfully generated applications will be shown. The participant receives the
Read More