WLP will definitely be a winner by 2025, declared Yole Développement (Yole) in its new Advanced Packaging Quarterly Market Monitor. $2.5B will be the market figure to remember as it will be Fan-out (FO) package revenue by 2025. Behind this data, there is TSMC’s strategy to drive fan-out for 5G applications. In parallel,
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“The demand for SiP[1] has increased significantly in recent years, with an adoption in a wide ranging of applications”, announces Favier Shoo, Technology & Market Analyst at Yole Développement (Yole). “SiP involves low-end including smaller package size & lower I/O count and high-end applications with larger package size & higher I/O. SiP is also leveraging
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“Advanced packaging solutions will double their market shares within the automotive industry in the coming 5 years, reaching US$550 million” announces Mario Ibrahim, Technology & Market Analyst at Yole Développement (Yole).
Two automotive megatrends, autonomy and electrification are today pushing the development of multiple devices with dedicated packaging. Without doubts, the automotive
Lead Frame Overview
A lead frame is a generic term for a type of (mostly) low-cost IC package assembly used for DIL types packages as well as PLCCs and QFNs.
The frame is typically made of a thin layer of copper, though other materials, such as aluminum
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Extracted from: Equipment and Materials for Fan-Out Packaging report and Fan-Out Packaging: Technologies & Market Trends, Yole Développement, 2019
“Although the inflated excitement has started to plunge after few years of hype, Fan-Out technologies are still very well established in low-end and high-end applications”, asserts Favier Shoo, Technology & Market Analyst at Yole
This interview was help with Mr. Oren Beckermus, which is Co-CEO of Beckermus.
Tell me about Beckermus Technologies?
Beckermus Technology is a privately-owned company, I co-own it with my brother, Oded Beckermus, the name of the company as you can already guess comes from our family
