Amkor Technology, Inc., a leading provider of semiconductor packaging and test services, today announced that multiple factories have passed certification audits for IATF-16949:2016, a key certification required for manufacturers who supply products to the automotive market. IATF-16949:2016 replaces and supersedes the older ISO/TS-16949 standard.
Despite the common belief, OSAT (Outsourced Semiconductor Assembly and Test) companies are very innovative. Many look at TSMC or Synopsys and consider their R&D work as innovative. But actually, semiconductor assembly industry is as innovative as any other company in the industry. We just don’t hear about it.
Semiconductor
Advanced Semiconductor Engineering, Inc. (ASE, TAIEX: 2311, NYSE: ASX), and Cadence Design Systems, Inc. (NASDAQ: CDNS), today announced they have collaborated to release a System-in-Package (SiP) EDA solution that addresses the challenges of designing and verifying Fan-Out Chip-on-Substrate (FOCoS) multi-die packages. The solution consists of the SiP-id™ (System-in-Package – intelligent
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System performance is a critical requirement for the vast majority of integrated circuits that are designed today. To meet these stringent performance requirements, IC designers invest considerable time and effort in accurately modeling and simulating chip level performance – all to avoid nasty surprises when the first chips return from fabrication. Performance
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If you were uncertain about the term “FlipChip” this tutorial will help you better understand what FlipChip packaging technology is all about.
FlipChip package technology has been around for 3-4 decades and started as a package solution for high pin count & high performance package requirements. At the
Abstract
Expanding its ChipArray® Ball Grid Array (CABGA) package form factor miniaturization efforts, Amkor now offers a maximum 0.40 mm height CABGA assembly process. Amkor’s latest CABGA process has been extensively demonstrated, evaluated and optimized to provide reliable, high-quality production. By extending CABGA capabilities to various competing near die size