Due to the growth of the semiconductor business, the wider adoption of Cu pillar solutions and the introduction of Flip Chip technology for LED and CMOS Image Sensors (CIS) applications, the Flip Chip market is expending. Under this context, more and more industrial companies including OSATs, IDMs IC foundries and
Read More“The fact that TSMC is interested in advanced packaging isn’t “new news”, comments Jean-Christophe Eloy, President & CEO, Yole Développement (Yole). He adds: “Over the last few years TSMC has significantly invested in flip-chip copper pillar capacities (Source: 2015 Flip Chip Business Update report, October 2015) and 3DIC stacking for
Read MoreAccording to the latest reports, Temasek and China’s Jiangsu Changjiang Electronics Technology Co Ltd (JCET) just signed a $1.8 million deal that will allow JCET to acquire STATS ChipPAC from Temasek.
The decision followed the new internal financial policy at Temsasek which aims to diversify the
Mergers and acquisitions happen very frequently in the semiconductor industry. However, what it is not common that these kind of operations proceed smoothly, quickly and without hurdles. This is the case of the public takeover of Siliconware Precision Industries (SPIL) for Advanced Semiconductor Engineering Inc (ASE). Indeed, the company dealing
Read MoreWith the creeping rise in the price of gold, many microelectronics manufacturing companies have been looking for alternatives to reduce the cost of ball bonding. Recently, the trend has been to look into the use copper wire. However, there are many drawbacks to using copper wire, including the short shelf
Read MoreWith the increased demand for improved functionality and miniaturization in portable hand-held devices—such as cell phones, PDA, digital cameras and laptop computers—original equipment manufacturers (OEMs) and integrated device manufactures (IDMs) have joined forces to ensure enhanced chip performance without sacrificing valuable board real estate. Rather than use conventional single chip
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