Bac Ninh, Vietnam – September 13, 2023 – Amkor Technology, a leading global provider of semiconductor packaging and test services, has announced significant progress in its operations at its new facility in Bac Ninh, Vietnam. The company, which commenced operations in August 2023, is already experiencing strong growth and contributing to
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Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today introduced its advanced packaging coordinated platform for the vertical disintegration of chiplets. This unique platform streamlines the advanced packaging processes by integrating multiple vendors and multi-source chiplets and provides three core advanced packaging services – design,
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TrendForce reveals that sales of advanced packaging equipment are expected to grow by more than 10% in 2024, with the potential to exceed 20% in 2025. This growth is being driven by major semiconductor manufacturers’ ongoing expansion of advanced packaging capacity and the rapidly expanding global AI server market.
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Taipei, August 16 – Taiwan Semiconductor Manufacturing Co. (TSMC), the world’s largest contract chipmaker, has announced the purchase of a plant and equipment from flat panel maker Innolux Corp. for NT$17.14 billion (US$531 million). The acquisition, located in the Southern Taiwan Science Park, encompasses a 317,445 square meter facility and related
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According to Yole Group, in the Advanced Packaging Market Monitor Q2 2024, advanced packaging revenue reached US$10.2 billion in Q1 2024. This quarter is anticipated to be the weakest of the year, with an 8.1% revenue decline from the previous quarter due to the seasonality that typically impacts the back-end business
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Jul. 3, 2024 —- In 2016, TSMC developed and named its InFO FOWLP technology, and applied it to the A10 processor used in the iPhone 7. TrendForce points out that since then, OSAT providers have been striving to develop FOWLP and FOPLP technologies to offer more cost-effective packaging solutions.
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