Category Archives: Packaging

WLCSP Overview, Market and Applications

Since the development of the first ASIC, the IC package was a mean to protect the silicon die and to provide means to PCB connectivity. Back then, the IC package was large and introduced various electrical parasitic.
 
WLCSP package is one of the latest and most impressive invention of

Advanced Packaging Technologies are key for Semiconductor Innovation

“2017 was an unprecedented year for semiconductor industry”, comments Santosh Kumar, Director of Packaging, Assembly and Substrates at Yole Korea, part of Yole Développement (Yole). “The market grow by 21.6% year-to-year to reach record of almost US$412 billion”. Under this dynamic context, the advanced packaging industry is playing a key role, offering huge opportunities of

JCET Group Appoints Distinguished Semiconductor Industry Executive Dr. Lee Choon Heung as CEO

STATS ChipPAC Pte. Ltd. (“STATS ChipPAC” or the “Company”), a leading provider of advanced semiconductor packaging and test services, announced Friday that the Board of Directors of its holding company, Jiangsu Changjiang Electronics Technology Co., Ltd (‘JCET’) has appointed Dr. Lee Choon Heung as Chief Executive Officer (‘CEO’) for JCET

Amkor Opens New Semiconductor Package Manufacturing and Test Plant in Taiwan

Amkor Technology announced on September 10th the opening of its new manufacturing and test plant at Longtan Science Park in Taiwan.

“Demand for Amkor’s advanced assembly and test services in Taiwan continues to increase.  The opening of our fourth factory in Taiwan will allow us to keep

Choose Through Silicon Via (TSV) Packaging for Improved Performance

A smaller form-factor with higher data transfer rate, signal integrity, memory bandwidth, and thermal capability are all criteria for improving system performance. Today’s highly integrated and portable products strive to improve all of these metrics. Through Silicon Via (TSV) packaging technology enables homogenous and heterogeneous integration of logic and memory

Beckermus Adds a New Active Alignment Machine: ficonTEC CL1500

Innovative medical devices, autonomous vehicles, IoT applications, cloud based organizations, 5G communication networks and more high-end industries are basing their products on microelectronics and micro-optical components.
Constant reduction in chip size and uncompromising placement accuracy demands are some of the dominant challenges those industries are facing.
We, in Beckermus Technologies,