Because Sondrel offers a full turnkey service of ASIC production from design through to shipping silicon, it knows what is happening with services at every stage of the manufacturing and test process. It says that it has noticed increased lead times for SOC package design and manufacturing, particularly for flip
Read MoreIt has been our pleasure to interview Sureshbabu K, MD of Caliber Interconnect Solutions. In this engaging conversation, he shares Caliber’s journey so far and what lies ahead for his company as it has emerged stronger in the post pandemic world and poised to grow significantly in the years to
Read MoreAnySilicon, the leading marketplace for semiconductor service providers, announced today that QP Technologies, a worldwide leader in packaging and assembly services, has partnered with AnySilicon to promote its IC packaging and assembly services. As part of the AnySilicon platform, QP Technologies will gain access to a full range of online
Read MoreBoston, MA – AEMtec GmbH from Berlin, Germany, a company widely known for its high precision microelectronic and Silicon Photonic assembly capabilities, announced today the September 1st opening of its anticipated Engineering Tech Center within the Boston University Photonics Center.
Says Robin Jerratsch, a highly skilled and experienced microelectronics
AnySilicon, the leading marketplace for semiconductor service providers, announced today that Caliber Interconnect Solutions, a product engineering solutions company, has joined AnySilicon to promote its semiconductor engineering services. As part of the AnySilicon platform, Caliber will gain access to a full range of online marketing services to showcase its offering,
Read MorePower semiconductor packages are used in high temperature, high voltage environments. With the increase of electric vehicles (EVs) and hybrid electric vehicles (HEV) in the automotive market, demands on (and for) power packages have been growing. Packages for automotive applications must pass extensive testing for safety, therefore, packaging reliability is
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