Category Archives: Packaging
Accurate Performance Analysis Requires Package Modeling
System performance is a critical requirement for the vast majority of integrated circuits that are designed today. To meet these stringent performance requirements, IC designers invest considerable time and effort in accurately modeling and simulating chip level performance – all to avoid nasty surprises when the first chips return from fabrication. Performance
Read MoreFlipChip Package Overview
If you were uncertain about the term “FlipChip” this tutorial will help you better understand what FlipChip packaging technology is all about.
FlipChip package technology has been around for 3-4 decades and started as a package solution for high pin count & high performance package requirements. At the
Wire-Bond Chip Array BGA — A New Near Die Size Packaging Innovation
Abstract
Expanding its ChipArray® Ball Grid Array (CABGA) package form factor miniaturization efforts, Amkor now offers a maximum 0.40 mm height CABGA assembly process. Amkor’s latest CABGA process has been extensively demonstrated, evaluated and optimized to provide reliable, high-quality production. By extending CABGA capabilities to various competing near die size
IC Test Flow For Advanced Semiconductor Packages
Higher bus speeds and lower power consumption are design criteria for most modern digital electronic products. Packaging solutions that provide higher bus speeds at reduced power per bit ratios require design techniques that shorten the distance between chips (to reduce drive currents) and use wider data buses (with finer line-space
Read MoreAmkor Technology to Acquire NANIUM
TEMPE, Ariz. and VILA DO CONDE, Porto, Portugal, February 2, 2017 – Amkor Technology, Inc. (Nasdaq: AMKR) and NANIUM S.A. today announced that they have entered into a definitive agreement for Amkor to acquire NANIUM, a world class provider of wafer-level fan-out (WLFO) semiconductor packaging solutions. Terms of the transaction
Read MoreSilicon Wafer Integrated Fan-out Technology Packaging for Highly Integrated Products
The continued growth of the mobile handset, tablet, and networking markets requires ongoing development of innovative packaging technologies. The required solutions must provide reduced form factor and high thermal and electrical performance as well as increased functional convergence and system integration. To meet the extremely small interconnect feature sizes in
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