Category Archives: Packaging
Investment: Wafer Level Packaging Company Receives $51.5M Investment
Deca Technologies, a wafer level packaging provider to the semiconductor industry, announced today the receipt of an additional $51.5 million investment from a leading electronics company. Combined with the previously announced investment from ASE of $60 million, and following the repurchase of $20.6 million of shares held by Cypress Semiconductor Corp.,
Read MoreQFN Package Body Size and Lead Count – Infographics
QFN package is the most successful package type today. Offering low price, excellent performance and small size, it is an ideal package for many applications.
QFN package comes in different size and different lead count. This infographics shows the most popular body size and lead count provided by leading OSAT
AnySilicon Launches Online Package Price Estimation Tool
AnySilicon, the fastest-growing semiconductor vendors platform has announced today the availability of its free Semiconductor Package Price Estimator which provides package price for all major semiconductor packaging type.
Using this free tool, companies can get quick price estimation for the packaging and assembly prices which are becoming critical in many
2.5D & 3D ICs — Do We Have A Liftoff?
All the work that’s been done on stacked die really could pay off soon.
The challenges of Moore’s law scaling at advanced technology nodes are well documented. I won’t repeat them here. The benefits of “more than Moore” scaling (i.e., 2.5D and 3D ICs) are also well-known. This technology
Integrated Circuit Packaging Overview
An integrated circuit package has the sole purpose of protecting and maintaining one or more integrated circuits. It is usually in the form of a plastic, glass, metal, or ceramic casing which creates a physical barrier of protection against things like impact and corrosion. Furthermore, it helps to hold contact
Read MoreElectrical Design and Modeling Challenges for 3D System Integration
Over the last several years, the buzzword in the electronics industry has been “More than Moore”, referring to the embedding of components into the package substrate and stacking of ICs and packages using wirebond and package on package (POP) technologies. This has led to the development of technologies that can
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