This interview was help with Mr. Oren Beckermus, which is Co-CEO of Beckermus.
Tell me about Beckermus Technologies?
Beckermus Technology is a privately-owned company, I co-own it with my brother, Oded Beckermus, the name of the company as you can already guess comes from our family
The leading giant of the OSATs, ASE Technology Holding Co., Ltd. (formerly ASE Inc.) and subsidiaries, has just got even bigger after the official acquisition of SPIL on April 30 2018. In 2018e, ASE Technology Holding Co., Ltd and subsidiaries made a new record-high revenue of US $12,308 billion, which
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Semiconductor integrated circuits (ICs) are an essential component of every other modern technology which is why they have undergone some of the most extensive growth. Today, IC packaging offering is wide and deep with many kinds and types of semiconductor packaging technologies. Your goal is, therefore, to select an IC
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This interview was held with Mr. Oliver Maiwald, CEO of Sencio B.V.
Tell me a bit about your background? How did you first get started with Sencio?
I have had a fairly circuitous route to the role of CEO. My first step was as an electrical technician working on the
“Fan-Out Packaging is now a must-have in the portfolio to stay competitive,” asserts Favier Shoo, Technology & Market Analyst and part of the Semiconductor & Software team at Yole Développement (Yole). “New milestones are achieved by SEMCO and PTI with FOPLP technology. Both companies have invested and developed FOPLP for
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Ball Grid Array, commonly known as BGA, is one of the most widely used semiconductor package types for integrated circuits that require a high number of I/O connections, good electrical performance, reliable board mounting and efficient use of PCB area.
Get BGA Packaging Price Quotes
In a BGA