“Automotive is the new El Dorado for microelectronics,” announces Emilie Jolivet, Director, Semiconductor & Software at Yole Développement (Yole). The market is showing significant market drivers that are daily supporting the growth: electrification, connectivity, autonomy and comfort are the key words of the today’s automotive industry.
Under this dynamic context, the market research
The TOLL package is a highly efficient space-saving package featuring extremely low Rds(on) and strong thermal performance making it well suited for high current and high voltage applications. It meets an existing JEDEC package outline, is 30% smaller and 50% thinner than a DDPAK package. The TOLL package leads are designed with wettable flanks
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Since the development of the first ASIC, the IC package was a mean to protect the silicon die and to provide means to PCB connectivity. Back then, the IC package was large and introduced various electrical parasitic.
WLCSP package is one of the latest and most impressive invention of
“2017 was an unprecedented year for semiconductor industry”, comments Santosh Kumar, Director of Packaging, Assembly and Substrates at Yole Korea, part of Yole Développement (Yole). “The market grow by 21.6% year-to-year to reach record of almost US$412 billion”. Under this dynamic context, the advanced packaging industry is playing a key role, offering huge opportunities of
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STATS ChipPAC Pte. Ltd. (“STATS ChipPAC” or the “Company”), a leading provider of advanced semiconductor packaging and test services, announced Friday that the Board of Directors of its holding company, Jiangsu Changjiang Electronics Technology Co., Ltd (‘JCET’) has appointed Dr. Lee Choon Heung as Chief Executive Officer (‘CEO’) for JCET
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Amkor Technology announced on September 10th the opening of its new manufacturing and test plant at Longtan Science Park in Taiwan.
“Demand for Amkor’s advanced assembly and test services in Taiwan continues to increase. The opening of our fourth factory in Taiwan will allow us to keep
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