Category Archives: Packaging
Semiconductor Packaging History and Trends
Since the invention of the first semiconductor package in 1965, the semiconductor packaging technology has grown dramatically and several thousands of different semiconductor package types have been made. The chart below presents the semiconductor packaging history. Particularly it shows the two major trends in semiconductor packaging: addressing high pin
RF Package Design Focusing Portability
Today, the (SiP) System-in-Package approach offers a new dimension to system integration, far beyond mere dense micro-packaging of existing System on Chip solutions. Not only does SiP offer the capability to integrate almost any kind of companion passive component with a given active circuit, but it also enables flexible combinations
Read More2 Easy Steps to Find Semiconductor Packaging
Semiconductor Packaging has become a critical factor to any semiconductor company success. Engineers have to select a semiconductor package effectively to both meet demanding price pressure but also system level performance requirements and size limitations.
Furthermore, with today’s price pressures – companies are spending more time in finding, selecting,
Understanding Antenna in Package Design
Antenna in Package (or AiP) is an new trend in IC packaging which is an enabler of smaller and high integrated ICs that consists of ICs and Antenna inside a package. Antenna in Package allows integration of all the complex RF components, together with the base-band circuitry into a complete
Read MoreAdvanced Packaging Supply Chain – what is new?
The mobile sector is driving production and market growth; however a new market driver, IoT is on the horizon and is expected to have a significant impact on the advanced packaging industry. “IoT driven semiconductor industry consolidation, is reflecting into a highly dynamic advanced packaging landscape”, comments Andrej Ivankovic, Technology &
Read MoreMobility Drives Thin Packaging
For the packaging industry, the smartphone changed everything, and experts agree that more changes— potentially big ones—are underway.
Bill Chen, a senior fellow at ASE Group, said when personal computers ruled chip demand, the main components had fairly standard package formats. The pace of change has picked up in
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