Category Archives: Packaging

48V Ecosystem and Power IC Packaging Trends

With each passing year, emerging growth application areas such as Automotive, Cloud Computing, Industrial Automation and Telecom (5G) Infrastructure are garnering more attention. Although the application segments are different, there is commonality in how voltage conversion and power distribution are achieved at the system level. System demands are becoming more

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Understanding IC Package Thermal Characteristics


One of the most common factors that can have a lasting impact on any given semiconductor device is heat. Any logic circuit or electronic device requires a power supply to drive the function of its parts. While most of this power is used up for basic logic functions and signal

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Fan-Out packaging: what will be the next killer application?

“Fan-out packaging continues to evolve, establishing a new market class, UHD Fan-Out,” asserts Favier Shoo, Technology & Market Analyst at Yole Développement (Yole). “Being actively explored and validated as one of the high performing and multi-die packaging platforms, Fan-Out Packaging is breaking through into new applications in 5G and HPC. In the Fan-Out Packaging: Technologies

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Wafer Level Packaging Market Information 2020

WLP will definitely be a winner by 2025, declared Yole Développement (Yole) in its new Advanced Packaging Quarterly Market Monitor. $2.5B will be the market figure to remember as it will be Fan-out (FO) package revenue by 2025. Behind this data, there is TSMC’s strategy to drive fan-out for 5G applications. In parallel,

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System-in-Package (SiP), a success story

“The demand for SiP[1] has increased significantly in recent years, with an adoption in a wide ranging of applications”, announces Favier Shoo, Technology & Market Analyst at Yole Développement (Yole). “SiP involves low-end including smaller package size & lower I/O count and high-end applications with larger package size & higher I/O. SiP is also leveraging

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Vehicle autonomy & electrification are pushing the adoption of advanced packaging

“Advanced packaging solutions will double their market shares within the automotive industry in the coming 5 years, reaching US$550 million” announces Mario Ibrahim, Technology & Market Analyst at Yole Développement (Yole).
Two automotive megatrends, autonomy and electrification are today pushing the development of multiple devices with dedicated packaging. Without doubts, the automotive

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