Category Archives: Packaging

AEMTec Joins AnySilicon’s Marketing Platform


AnySilicon, the leading marketplace for semiconductor service providers, announced today that AEMTec, a leading packaging and assembly services provider, has joined AnySilicon to promote its services. As part of the AnySilicon platform, AEMTec will gain access to a full range of online marketing services to showcase its offering, increase exposure

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Qmode project with QuiX

The Qmode project is funded with an MIT-R&D collaboration project grant from the Provincie Overijssel, dedicated to stimulate the innovation and development of products, processes and services of local SMEs working in the Dutch Top Sectors. The collaboration established in Qmode will help QuiX secure a leading position in the

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Amkor Factory Intelligence Enables Industry 4.0

TEMPE, Ariz., February 23, 2021 ― Amkor Technology, Inc. (Nasdaq: AMKR), a leader in advanced packaging technologies that support high-growth markets, including smartphones and 5G, advanced automotive systems, high-performance computing and consumer IoT, recently unveiled new measures that help the company achieve Industry 4.0 initiatives, extending its leadership in quality

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Webinar – High End Electronics meets Optics

AEMtec GmbH located in Berlin Germany provides a new 2021 Eight Session Webinar Series “Next Level of Technology – High End Electronics meets Optics”. Launch of webinar series in February. New industry trends, technology portfolio, implementation strategies as well as already successfully generated applications will be shown. The participant receives the

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Unit-Level Traceability for Automotive Customers

Automotive product traceability has existed in one form or another for several decades. Traceability generally refers to tracking and tracing each component that comprises every sub-system in a car. Traditionally, this has been achieved with direct part marking on mechanical or electronic components, using 1D or 2D barcodes or radio-frequency

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ficonTEC and PHIX partner to enable high-volume manufacturing of multi-chip photonic modules

PHIX B.V. of Enschede, The Netherlands, is a Dutch packaging foundry that assembles their customers’ photonic integrated circuits into complete modules. As these modules evolve from initial prototypes into mature products, the manufacturing volumes become much larger and a higher level of automation is required. This aspect of photonic device

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