Packaging Archives - Page 3 of 20

Amkor Announces US Advanced Packaging and Test Facility

TEMPE, Ariz.–(BUSINESS WIRE)–Nov. 30, 2023– Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, has announced its plan to build an advanced packaging and test facility in Peoria, Arizona. By the time of full project completion, Amkor projects to invest approximately $2 billion and employ

Flip Chip: The Ultimate Guide

Flip chip , also known as “controlled-collapse chip connection” (C4), is an advanced semiconductor packaging technique that allows the direct attachment of a semiconductor chip, typically an integrated circuit (IC), to a substrate or circuit board. Unlike traditional packaging methods like wire bonding, in flip chip technology, the active side

The Ultimate Guide to Semiconductor Packaging

Semiconductor packaging is a crucial aspect of electronics manufacturing that involves enclosing semiconductor chips in protective and functional packages to ensure their reliability, performance and integration into electronic devices. These packages serve as a bridge between the tiny, sensitive semiconductor chips and the broader electronic systems, providing electrical connections, thermal

Q&A with Prasad Dhond, Vice President WBBGA and QFN Products, Amkor Technology Inc.

Tell us a bit about yourself and your background

I have worked in the semiconductor industry for 20+ years. I started at Texas Instruments where I held roles in engineering and marketing analog Integrated Circuits (ICs). After 12 years at TI, I joined Amkor where I currently hold P&L

Steady growth in next-gen Fan-Out packaging

FO packaging revenue was US$1.86 billion in 2022. Yole Intelligence, part of Yole Group, expects it to have a CAGR of 12.5% through 2028, reaching US$3.8 billion. UHD FO will experience the fastest growth across all market classes, with a CAGR of 30%, growing from US$338 million in 2022 to

Amkor Technology and GlobalFoundries to Provide At-scale Semiconductor Test and Assembly Services in Europe

TEMPE, Ariz. and DRESDEN, Germany, February 16, 2023 — Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, and GlobalFoundries (Nasdaq: GFS) (GF), a global leader in feature-rich semiconductor manufacturing, announced today that the two companies have formed a strategic partnership. This new partnership will enable

Category Archives: Packaging

Amkor Announces US Advanced Packaging and Test Facility

Flip Chip: The Ultimate Guide

The Ultimate Guide to Semiconductor Packaging

Q&A with Prasad Dhond, Vice President WBBGA and QFN Products, Amkor Technology Inc.

Steady growth in next-gen Fan-Out packaging

Amkor Technology and GlobalFoundries to Provide At-scale Semiconductor Test and Assembly Services in Europe

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Category Archives: Packaging

Amkor Announces US Advanced Packaging and Test Facility

Flip Chip: The Ultimate Guide

The Ultimate Guide to Semiconductor Packaging

Q&A with Prasad Dhond, Vice President WBBGA and QFN Products, Amkor Technology Inc.

Steady growth in next-gen Fan-Out packaging

Amkor Technology and GlobalFoundries to Provide At-scale Semiconductor Test and Assembly Services in Europe

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