Category Archives: Testing

Foxconn and HCL JV Secures Land for Semiconductor Plant in Uttar Pradesh, India

[Sep 13, 2024] – Foxconn, a leading global electronics manufacturer, and HCL Technologies, a leading Indian technology services company, have taken a significant step towards establishing a semiconductor plant in Uttar Pradesh, India. The joint venture (JV) between the two companies has secured a 30-acre plot of land in Noida, near

CoreHW and Presto Engineering Announce Ground-breaking Collaboration to Advance Global Penetration of Ultra-low-power RF IoT Devices

Meyreuil, France—September 3, 2024— CoreHW, a leading fabless semiconductor company, and Presto Engineering, a European expert in application specific integrated circuit (ASIC) design, engineering, and production services, have announced their successful collaboration in developing the first enhanced low-power radio frequency (RF) 2.4GHz front-end module in an ultra-small and thin wafer-scale

Teradyne Marks 8,000th J750 Semiconductor Test System Shipment

NORTH READING, MA / ACCESSWIRE / May 21, 2024 / Teradyne, Inc. (NASDAQ:TER), a leading supplier of automated test equipment, today announced shipment of its 8,000th J750 semiconductor test platform. This milestone has been achieved with V-Test, a leading outsourced semiconductor assembly and test (OSAT) vendor in China.

 
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First OSAT in the Middle East: Israel Strengthens Semiconductor Independence by Uniting iNPACK Expertise with ATS Engineering

iNPACK (a PCB Technologies Ltd. Company) and cutting-edge IC packaging and assembly house in Israel, in conjunction with ATS Engineering, a leading IC Test House based in Israel, have announced a transformative collaboration in order to establish the first Outsourced Semiconductor Assembly and Test (OSAT) facility in the Middle East. This pioneering venture aims to

Presto and T&W Engineering Announce Long-Term Partnership to Advance Wearable Brain Sensing

Meyreuil, France—November 2, 2023—Presto Engineering, a European leading expert in application-specific integrated circuit (ASIC) design and semiconductor engineering and production services, and T&W Engineering, the leading in-ear electroencephalogram (EEG) wearable device developer and provider of artificial intelligence (AI)-driven EEG reading services, today announced their collaboration to develop an ASIC for measuring

Presto Engineering Announces its Collaboration with Nokia as Part of France 2030 Investment Plan

Meyreuil, France – October 5, 2023 – Presto Engineering, a recognized expert in ASIC design and semiconductor engineering and production services, is pleased to announce its collaboration with Nokia for the industrialization of new equipment designed to build the foundations of the next generation of microwave links as part of