MILPITAS, Calif. — January 7, 2025 — The semiconductor industry is expected to start 18 new fab construction projects in 2025*, according to SEMI’s latest quarterly World Fab Forecast report. The new projects include three 200mm and fifteen 300mm facilities, the majority of which are expected to begin operations from 2026 to 2027.
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Jan. 6, 2025–According to Ben Bajarin, CEO and Principal Analyst at Creative Strategies, the cost of manufacturing Apple’s chips has skyrocketed. The transition from the A7’s 28nm process to the A18 Pro’s cutting-edge 3nm node has seen wafer prices increase from $5,000 to $18,000 per wafer, a nearly fourfold increase.
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Dec-11, 2024 — Today, the Biden-Harris Administration announced that the U.S. Department of Commerce signed three separate preliminary memoranda of terms (PMT) under the CHIPS and Science Act to provide up to $33 million in proposed direct funding to Coherent, up to $16 million in proposed direct funding to
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ESSEX JUNCTION, Vt., December 4, 2024 — GlobalFoundries (Nasdaq: GFS) (GF) has received an additional $9.5 million in federal funding from the U.S. government to advance the manufacturing of GF’s essential gallium nitride (GaN) on silicon semiconductors at its facility in Essex Junction, Vermont. The funding moves GF closer to large-scale
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Singapore, Dec. 4, 2024 – VisionPower Semiconductor Manufacturing Company Pte Ltd (VSMC), the joint venture formed in September, 2024 by Vanguard International Semiconductor Corporation (VIS, TPEx 5347) and NXP Semiconductors N.V. (NXP, NASDAQ: NXPI) today celebrated breaking ground at the site of the joint venture’s new 300mm wafer manufacturing facility
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December 2nd, 2024 — Taiwan Semiconductor Manufacturing Co. (TSMC), the world’s leading contract chipmaker, today announced the commencement of equipment installation for its groundbreaking 2-nanometer fabrication facility in Kaohsiung, Taiwan. This milestone marks a significant acceleration of the project, with installation beginning six months ahead of schedule.
Kaohsiung Mayor