Get the semiconductor daily news directly to you by subscribing to our email list. For ASIC designer and managers, staying updated with the latest news, technologies, and trends is crucial. Here are the lastest news from the semiconductor industry.
Timing ECOs refer to last mile timing and DRC fixes before you tape-out the ASIC. EDA implementation tools (with help of physical design engineers) do 95-98% of the job when it comes to meeting the timing goals. For the last 1-2% timing violations, however, it is prudent to handle them
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Sankalp Semiconductor a design service company offering comprehensive digital & mixed signal SoC solutions, will be presenting paper at CDNLive India 2018 during 6th & 7th September. The selected paper talks in depth on the “Automated Test Case Creation for Design Rule Deck Validation (DRDV)”. The paper will cover the
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Wafer fabrication facilities, commonly known as wafer fabs, are the backbone of the semiconductor industry. These highly specialized factories process silicon wafers into integrated circuits (ICs) used in nearly every electronic device today. Let’s take a closer look at the global distribution and
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Moortec, providers of complete In-Chip Monitoring PVT Subsystems announced today that Tiannengbo Information Technology have utilised Moortec’s Temperature Sensor IP to optimise performance and increase reliability in their latest mining ASIC.
As a company Tiannengbo’s main focus is on chip and system design, production and sales. The company also
NXP Semiconductors N.V. (NASDAQ: NXPI), the world’s largest supplier of automotive semiconductors1, has acquired OmniPHY, a provider of automotive Ethernet subsystem technology. The company’s expertise includes automotive Ethernet, a technology that enables the rapid data transfer required for autonomous driving. OmniPHY’s advanced high-speed technology, combined with NXP’s leading portfolio and
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A smaller form-factor with higher data transfer rate, signal integrity, memory bandwidth, and thermal capability are all criteria for improving system performance. Today’s highly integrated and portable products strive to improve all of these metrics. Through Silicon Via (TSV) packaging technology enables homogenous and heterogeneous integration of logic and memory
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Sankalp Semiconductor, a design service company offering comprehensive digital & mixed signal SoC services and solutions, will be exhibiting and presenting at D&R IP-SoC Day on 13th September in Shanghai, China. Sankalp Semiconductor offers services and solutions to its customers in key semiconductor domains including digital, analog, mixed signal, custom
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IC Insights forecasts total semiconductor capital expenditures will rise to $102.0 billion this year, marking the first time that the industry has spent more than $100 billion on capital expenditures in one year. The $102.0 billion spending level represents a 9% increase over $93.3 billion spent in 2017, which was a
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GLOBALFOUNDRIES today announced an important step in its transformation, continuing the trajectory launched with the appointment of Tom Caulfield as CEO earlier this year. In line with the strategic direction Caulfield has articulated, GF is reshaping its technology portfolio to intensify its focus on delivering truly differentiated offerings for clients
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Innovative medical devices, autonomous vehicles, IoT applications, cloud based organizations, 5G communication networks and more high-end industries are basing their products on microelectronics and micro-optical components.
Constant reduction in chip size and uncompromising placement accuracy demands are some of the dominant challenges those industries are facing.
We, in Beckermus Technologies,