Semiconductor Latest News

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HDL Design House Greece Joins HETIA

Latest News

HDL Design House Greece, provider of digital, analog, and back-end design and verification services and products in numerous areas of SoC, announced membership of the Hellenic Emerging Technologies Industry Association (HETIA), an association of high tech industries to represent the dynamic Greek sector of semiconductors, micro- & nano- electronics.
 
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RoodMicrotec reports its strongest first half‐year sales in 7 years

RoodMicrotec N.V., the leading independent company for semiconductors supply and quality services, increased its half year sales by 17 percent year‐on‐year due to its strong ordering intake, especially in the areas Test Operations and Supply Chain Management. Within the markets, RoodMicrotec raised its sales in the industrial sector by 17

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Inomize joins Arm Approved Design Partner program

Inomize, one of the global ASIC Design Services leader has joined the Arm Approved Design Partner program . The program provides users of the Arm® DesignStart™ initiative with a global list of audited design houses offering expert support during the development of SoC designs.
 
“Inomize is thrilled to join the Arm

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China’s Semi Capex Forecast to be Larger than Europe and Japan Combined in 2018

Investment budget local government

IC Insights will release its 200+ page Mid-Year Update to the 2018 McClean Report next month.  The Mid-Year Update will revise IC Insights’ worldwide economic and IC industry forecasts through 2022 that were originally presented in the 2018 McClean Report issued in January of this year.
 
Figure 1 shows that IC Insights forecasts that China-headquartered companies will spend

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Silicon Creations’ SerDes Technology Helps Power Leading-Edge 8K TV

Partnership

Silicon Creations, a leading supplier of high-performance analog and mixed-signal intellectual property (IP), announced today that its SerDes (Serializer/Deserializer) receive and transmit PMA (Physical Media Attachment) technology has been deployed in an SoC that powers a leading 8K (UHD) flat-panel television.
 
The SoC was designed by Socle, an IC ODM

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Sankalp Semiconductor Announces Availability of Automated Analog Validation Services Environment – SAVE

text labeled PRESS RELEASE

Sankalp Semiconductor, a design service company offering comprehensive digital & mixed signal SoC services and solutions, today at 55th DAC 2018 announced the availability of Sankalp Automated Validation Environment (SAVE). Sankalp will be demonstrating a video demo of the solution at its booth #2457. SAVE allows post-silicon validation of Analog

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How to Cut Costs, Time and Pain during ASIC Manufacturing

Managing an end-to-end ASIC supply chain process is one of the biggest challenges of chip projects. The semiconductor value chain, which has always been complex, does not seem to get any simpler. A McKinsey report pointed out “there has been a 50 percent increase in test and verification time during

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Sankalp Semiconductor announces release of its eDP receiver IP for Chip on Glass Applications

News

Sankalp Semiconductor a design service company offering comprehensive digital & mixed signal SoC solutions today at 55th DAC 2018 announced release of its Embedded DisplayPort (eDP) receiver IP. DisplayPort offers high bandwidth, lower pin count and low power solutions for high-resolution displays. The Chip on Glass (COG) technology enables area

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CEO Talk: Udi Shaked, Inomize

This interview was conducted with Udi Shaked, CEO of Inomize.
 
Full Name: Udi Shaked
Title: CEO
Company: Inomize

 
 
Tell me a bit about your background. How did you first get started with Inomize? 
 
We came up with the idea of launching Inomize back in 2007,

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eWLB Package Overview

wafer bumping feature

The eWLB (Embedded Wafer Level Ball Grid Array) package technology was developed in cooperation between 3 companies: Infineon, STMicroelectronics and STATS ChipPAC to solve an interconnect problem that was introduced by the fan-in packaging technology (WLCSP).
 
The first eWLB package was used in mobile phones in 2009 and since

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