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Lekha Wireless, the leading wireless communications and embedded systems technology company, has signed an agreement with T2M, the world’s largest independent global semiconductor IP provider, to act as a global representative and business development partner of Lekha Wireless’ IP and technology solutions.
Lekha Wireless has a wide range of
Hsinchu, Taiwan, R.O.C., Aug 5, 2018 – TSMC today provided an update on the Company’s computer virus outbreak on the evening of August 3, which affected a number of computer systems and fab tools in Taiwan. The degree of infection varied by fab. TSMC contained the problem and found a solution.
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IP-Maker announces the availability of a NVMe Host reference design, to be showcased at Flash Memory Summit, in Santa Clara, on August 7 to 9. It highlights the integration of the NVMe Host IP from IP-Maker in a powerful FPGA, able to manage data transfer with a Gen3 x4 NVMe
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Facebook is doing it, Google is doing it, even Amazon and Bosch are doing it. They have started designing ASICs (Application Specific Integrated Circuit, aka SoCs, ICs, chips). In fact, system companies are becoming the new ASIC designers and manufacturers. If you are a non-silicon company, this paper will help
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This interview was held with Karel Masařík, Founder and Chief Executive Officer at Codasip, Ltd.
Tell me a bit about your background. How did you first get started with your company?
Codasip was born a decade ago out of my PhD work at the Technical University of Brno. I
Sankalp Semiconductor, a design service company offering comprehensive digital & mixed signal SoC services and solutions, has appointed Sathish Kumar Ganesan in the key position of Vice President Engineering for IP Business. In this capacity, Sathish will be responsible for IP development and related engineering services. He has 16+ years
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Amkor Technology announced today it has partnered with Mentor to release Amkor’s SmartPackage™ Package Assembly Design Kit (PADK), the first in the industry to support Mentor’s High-Density Advanced Packaging (HDAP) design process and tools. Amkor’s award-winning High-Density Fan Out(HDFO) process can now be used in conjunction with Mentor’s software to deliver
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Open-Silicon, a system-optimized custom SoC solution provider and long-standing member of TSMC’s Value Chain Aggregator (VCA) and Design Center Alliance (DCA) programs, and Credo, a global innovation leader in Serializer-Deserializer (SerDes) technology, will participate in a joint demonstration at the TSMC 2018 Open Innovation Platform Ecosystem Forum and Technology Symposium in
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In its upcoming Mid-Year Update to The McClean Report 2018 (to be released at the end of July), IC Insights forecasts that the 2018 global electronic systems market will grow 5% to $1,622 billion while the worldwide semiconductor market is expected to surge by 14% this year to $509.1 billion, exceeding the $500.0
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Inomize, a leading Israeli design services company, will present a paper at TSMC OIP Forum in Amsterdam, The Netherlands on Monday 23rd July, as well as exhibiting at the OIP Forum and the TSMC Symposium on Tuesday 24th July.
Abstract: Based on TSMC 16n FFC automotive process design of a multi processors System on Chip to be part