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Hsinchu, Taiwan — Jan. 19 2017 — Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, has received the certificate of ISO 26262 (Road vehicles-functional safety) from SGS-TÜV Saar on its design development process. Faraday is the first ASIC design service company in the world approved
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eInfochips, a leading Product Engineering and Software R&D services firm, recently announced that the company was rated in the “Leadership Zone” for Semiconductor services by Zinnov, in its annual “Zinnov Zones 2016 PES” ratings. eInfochips was also recognized under “Execution Zone” for Aerospace, Industrial Automation, Medical Devices, and Consumer Software.
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The continued growth of the mobile handset, tablet, and networking markets requires ongoing development of innovative packaging technologies. The required solutions must provide reduced form factor and high thermal and electrical performance as well as increased functional convergence and system integration. To meet the extremely small interconnect feature sizes in
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The pure-play semiconductor foundry market is forecast to play an increasingly stronger role in the worldwide IC market during the next five years, according to IC Insights’ new 2017 McClean Report, which becomes available later this month. The 20th anniversary edition of The McClean Report forecasts that the 2016-2021 pure-play
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When someone contributes to the success of your product, but they don’t work directly for your company, why should they work as hard as your employees ? Your employees, and to a smaller extent your suppliers, obviously have a financial interest in your company’s success. But success takes more than
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Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced its 55nm eFlash-based ASIC solution is ready to support better MCU performance. By skipping 90nm, Faraday’s MCU ASIC path strides directly from 8-inch 0.11μm to 12-inch 55nm eFlash process node, offering much lower power/leakage and
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Leuven, December 20th 2016 – AnSem NV, the leading analog, RF and mixed-signal ASIC solutions company expands its operations, opening an office in Enschede, The Netherlands.
The Dutch design center will be headed by Clemens Mensink, who has over 20 years of IC experience. AnSem BV will be located
Belgrade, Serbia – December 20th, 2016 – HDL Design House, a provider of high-performance digital and analog IP cores and system-on-chip (SoC) design and verification services, has joined the ARM® Approved Design Partner program, through which leading SoC design houses are recognized by ARM as accredited partners in specific technologies
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Prior to 2008, the 200mm silicon wafer was used in more cases for manufacturing ICs than any other wafer size. However, since 2008, the majority of IC fabrication has taken place on 300mm silicon wafers. Rankings of silicon manufacturers by installed capacity for each of the wafer sizes are shown
Read MoreAccording to Business Korea Samsung Electronics is considering a reorganization of the System LSI division in order to systematically grow the system semiconductor business. The company is planning to separate the design and manufacturing sectors in the business unit and divide or spin off it to fabless and foundry business
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