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Mannheim, Germany, January 30, 2025 — EXTOLL, a leading provider of high-speed and ultra-low-power SerDes and Chiplet connectivity, has been selected by BeammWave, an innovation leader in mmWave 5G/6G digital beamforming, as a key SerDes IP supplier for its next gen communication ASIC development portfolio on GlobalFoundries’ (GF) 22nm FD-SOI process
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Munich, Germany, and Oxford, UK – 28th January, 2025 — Codasip GmbH and RED Semiconductor International Ltd have signed a Memorandum of Understanding (MoU) to collaborate on developing advanced AI acceleration technologies.
Under the MoU, RED will leverage the Codasip Studio processor design tools to integrate its VISC technology as an accelerator for Codasip
The semiconductor industry is poised for a significant expansion in 2025, with plans to commence construction on 18 new fabrication plants (fabs). This surge, detailed in SEMI’s World Fab Forecast, reflects the industry’s projected growth to $697 billion in 2025, an 11.2% increase from 2024. While some fabs are slated
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Mont-Saint-Guibert, Belgium, January 28, 2025 – intoPIX, a leading provider of innovative image compression technologies, and PlexusAV, a pioneer in IPMX solutions, are proud to announce the successful interoperability testing between the Plexus P-AVN-4 IPMX JPEG XS FIP transceiver and the new intoPIX Titanium Software Suite. This collaboration highlights the
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SUNNYVALE, Calif., Jan. 21, 2025 /PRNewswire/ — Blue Cheetah Analog Design today announced the successful tape-outs of its next generation BlueLynx™ die-to-die (D2D) PHY on Samsung Foundry’s SF4X 4nm advanced manufacturing process. The latest PHY supports both advanced and standard chiplet packaging with an aggregate throughput exceeding 100 Tbps while
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SAN JOSE, Calif.— January 21, 2025 — Cadence (Nasdaq: CDNS) today announced it has entered into a definitive agreement to acquire Secure-IC, a leading embedded security IP platform provider. The addition of Secure-IC’s talent and highly complementary, proven portfolio of embedded security IP, security solutions, security evaluation tools and services will
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Multi Chip Modules (MCM) have emerged as a game-changing solution. As consumer demand for faster, more powerful electronics increases, traditional chip designs can no longer meet the growing need for performance and space-saving designs. MCMs offer a sophisticated approach to semiconductor architecture by integrating multiple chips into a single package.
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Heterogeneous integration offers a solution by allowing different materials and components to work together seamlessly, driving innovation in various applications. This approach not only enhances system performance but also enables the development of sophisticated electronic devices that are smaller, faster, and more efficient.
Understanding heterogeneous integration requires a grasp
MELVILLE, N.Y., Jan. 15, 2025 /PRNewswire/ — Micross Components, Inc. (“Micross” or the “Company”), a leading provider of high-reliability microelectronic product and service solutions for aerospace, defense, space, medical and industrial applications and a portfolio company of Behrman Capital, today closed the acquisition of Integra Technologies (“Integra”). Integra is an Outsourced Semiconductor
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SCOTTSDALE, Ariz. – Dec. 9, 2024 – onsemi (Nasdaq: ON) today announced that it has entered into an agreement to acquire the Silicon Carbide Junction Field-Effect Transistor (SiC JFET) technology business, including the United Silicon Carbide subsidiary, from Qorvo for $115 million in cash. The acquisition will complement onsemi’s extensive EliteSiC
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