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Imagine a world where data moves at the speed of light—literally. Silicon photonics makes this possible, merging optics with the familiar silicon used in traditional electronics.
This advanced technology, originating from the 1980s, stands today as a pivotal innovation in microelectronics. It offers faster data transfer rates and lower
In this guide, we’ll elucidate the pivotal role of FO-PLP in advancing the semiconductor sector. Harnessing cost-effectiveness with enhanced functionality, FO-PLP beckons a new era of electronic sophistication. Let’s delve into the ultimate guide to Fan-Out Panel-Level Packaging and explore how it’s shaping the future.
Overview of Fan-Out Panel-Level
By Christos Kasparis, EnSilica
EETimes (May 15, 2024)
The rise of quanum computing paints a significant challenge for the cryptography we rely on today. The modern encryption standards we currently use to safeguard sensitive data and communications, such as DSA, public key RSA and those based on elliptic curves,
In this guide, we’ll delve into what exactly embedded die packaging is, exploring its definition, and the myriad of benefits it provides across various applications. From space-saving designs to improved heat dissipation, this innovative approach to integrating semiconductor dies is pivotal for modern electronics.
Image courtesy: ASE
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AnySilicon, the leading platform for ASIC service providers, is delighted to announce its partnership with Avnet ASIC Israel, a distinguished leader in semiconductor design, manufacturing solutions and TSMC VCA. By joining AnySilicon, Avnet ASIC Israel gains access to a comprehensive suite of marketing promotion services aimed at showcasing its offerings,
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Jun. 5, 2024 —- On June 5th, Vanguard and NXP announced plans to jointly establish VisionPower Semiconductor Manufacturing Company (VSMC) in Singapore to build a 12-inch wafer plant. TrendForce posits that this move reflects the trend of global supply chains shifting “Out of China, Out of Taiwan”(OOC/OOT), with Taiwanese companies accelerating
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Woodcliff Lake, New Jersey — June 4, 2024 — Semiconductor intellectual property provider CAST today announced a new IP core that implements a hardware decompression engine for the LZ4 and Snappy lossless data compression algorithms.
The new LZ4SNP-D LZ4/Snappy Data Decompressor IP core receives compressed data files, detects the
This interview was held with CoreHW’s VP of Sales and Marketing, Mr. Tomi Moilanen.
Can you provide an overview of CoreHW’s experience and expertise in IC design? What sets CoreHW apart in terms of its capabilities and track record in this field?
CoreHW, founded in Finland
Imagine a world where every moment is captured with immaculate clarity, from the delicate hues of a sunset to the swift action of a sporting event. The heart of this imagery revolution lies in the CMOS image sensor (CIS), a masterpiece of technology little known outside expert circles. Its evolution
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NORTH READING, MA / ACCESSWIRE / May 21, 2024 / Teradyne, Inc. (NASDAQ:TER), a leading supplier of automated test equipment, today announced shipment of its 8,000th J750 semiconductor test platform. This milestone has been achieved with V-Test, a leading outsourced semiconductor assembly and test (OSAT) vendor in China.