Get the semiconductor daily news directly to you by subscribing to our email list. For ASIC designer and managers, staying updated with the latest news, technologies, and trends is crucial. Here are the lastest news from the semiconductor industry.
January 21, 2025 – January 23, 2025
Why should we go this summit
Why to Attend:
Position Your Company as a Leader in an Emerging Technology. Lay Claim to Your Share of a Projected $5.8 Billion Market (Omdia). Share Thoughts with Key Experts
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Dec-16-2024 — United Microelectronics Corporation (UMC) (TW:2303) today announced a significant breakthrough in the advanced packaging market, securing a major contract from Qualcomm Incorporated (NASDAQ:QCOM) for high-performance computing (HPC) applications. This win marks a pivotal moment, challenging the long-held dominance of Taiwan Semiconductor Manufacturing Company (TSMC) in this critical sector.
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12 Dec 2024 — SAN JOSE, Calif.— Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the appointment of Moshe Gavrielov to its board of directors, effective January 1, 2025. Mr. Gavrielov currently serves as a member of the board of NXP Semiconductors N.V. and Taiwan Semiconductor Manufacturing Company Ltd., as chair
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Dec-12, 2024 — Apple is accelerating its foray into the artificial intelligence (AI) market with the development of its first custom server chip, codenamed “Baltra,” designed specifically for AI processing. This groundbreaking initiative, reported by The Information and further detailed in recent reports, marks a significant step in Apple’s efforts
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Dec-11, 2024 — Today, the Biden-Harris Administration announced that the U.S. Department of Commerce signed three separate preliminary memoranda of terms (PMT) under the CHIPS and Science Act to provide up to $33 million in proposed direct funding to Coherent, up to $16 million in proposed direct funding to
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Hyderabad, India — December 11, 2024 — MosChip® Technologies selects Cadence 5nm EDA tools for the design of the High-Performance Computing (HPC) Processor “AUM” for C-DAC.
MosChip® Technologies is the first fabless semiconductor company publicly traded in India. It has over twenty-five years of experience designing products and SoCs with
ROHM Co., Ltd. (ROHM) announced today that ROHM and TSMC have entered a strategic partnership on development and volume production of gallium nitride (GaN) power devices for electric vehicle applications.
The partnership will integrate ROHM’s device development technology with TSMC’s industry-leading GaN-on-silicon process technology to meet the growing
[December 9, 2024] – A groundbreaking new report, “Chiplet Technology 2025-2035: Technology, Opportunities, Applications,” from HomeResearch reveals the burgeoning chiplet market is projected to skyrocket to US$411 billion by 2035. This transformative technology is revolutionizing the semiconductor industry by offering a modular and efficient alternative to traditional monolithic System-on-Chip (SoC)
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BLOOMINGTON, Minn. – December 6, 2024 – SkyWater Technology (NASDAQ: SKYT), the trusted technology realization partner, announced that it has signed a preliminary memorandum of terms (PMT) valued at up to $16 million with the CHIPS for America program, which is administered by the U.S. Department of Commerce. This proposed funding
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ESSEX JUNCTION, Vt., December 4, 2024 — GlobalFoundries (Nasdaq: GFS) (GF) has received an additional $9.5 million in federal funding from the U.S. government to advance the manufacturing of GF’s essential gallium nitride (GaN) on silicon semiconductors at its facility in Essex Junction, Vermont. The funding moves GF closer to large-scale
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