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SANTA CLARA, Calif. — October 25, 2024 — Silvaco Group, Inc. (Nasdaq: SVCO), a provider of TCAD, EDA software, and SIP solutions that enable semiconductor design and digital twin modeling through AI software and innovation, is proud to announce that its wholly-owned subsidiary Silvaco, Inc. (“Silvaco” or the “Company”) has obtained ISO 9001
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Executive Summary
In Q3 2024, X-FAB reported revenues of USD 206.4 million, marking a 12% decline year-on-year but a slight increase of 1% quarter-on-quarter. The company’s bookings amounted to USD 217.1 million, resulting in a book-to-bill ratio of 1.05, reflecting a robust demand despite market challenges. EBITDA was reported at
MILPITAS, Calif. ─ October 21, 2024 ─ Global shipments of silicon wafers are projected to decline 2% in 2024 to 12,174 million square inches (MSI) with a strong rebound of 10% delayed until 2025 to reach 13,328 MSI as wafer demand continues to recover from the downcycle, SEMI reported today
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Oct. 24, 2024 —- The latest investigations by TrendForce reveal that Chinese foundries are set to drive the bulk of mature process capacity growth in 2025, thanks to China’s domestic IC substitution policies. It is estimated that the capacity of the world’s top 10 mature process foundries will increase by 6%
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Oct. 24, 2024 — Taiwan Semiconductor Manufacturing Co. (TSMC), the world’s leading dedicated independent semiconductor foundry, today confirmed that it has halted shipments to a client after discovering that chips manufactured for that client ended up in products produced by Huawei Technologies. This action follows the company’s mid-October discovery and
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MALTA, N.Y. and EINDHOVEN, Netherlands, October 23, 2024– GlobalFoundries (Nasdaq: GFS) (GF) and NXP Semiconductors (NASDAQ: NXPI) today announced collaboration to drive next-generation solutions across a range of end markets including automotive, IoT and smart mobile devices. This collaboration leverages GF’s 22FDX® process technology platform and global manufacturing footprint to
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Arm Holdings Plc has terminated its architectural license agreement with Qualcomm Inc., ending Qualcomm’s ability to use Arm’s intellectual property for chip design. The termination, reported by Bloomberg, follows a 60-day notice from Arm. This action escalates an existing legal dispute between the two companies, set to begin in Delaware
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Shanghai, China, October 22, 2024–VeriSilicon (688521.SH) today announced that its DeWarp Processing IP DW200-FS has achieved ISO 26262 ASIL B automotive functional safety certification. The certificate was issued by TÜV NORD, an international inspection and certification institution.
VeriSilicon’s DW200-FS IP leverages advanced pixel mapping algorithms and cache-based data prefetch architecture,
Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and Wolfspeed, Inc. have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $750 million in proposed direct funding under the CHIPS and Science Act. The proposed funding would support the construction of a new silicon
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Imagine a world where electronic devices are exponentially more powerful yet astonishingly compact. This is the promise of 2.5D packaging, an innovative approach to semiconductor design. It’s reshaping the landscape of computing, from smartphones to servers.
In the realm of electronics, understanding the building blocks is key.