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BLOOMINGTON, Minn. – September, 2024 – SkyWater Technology (NASDAQ: SKYT), the trusted technology realization partner, today announced the appointment of Bassel Haddad as senior vice president and general manager of advanced packaging. Reporting to President and COO John Sakamoto, Haddad will build and scale SkyWater’s advanced packaging business serving both the defense
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Saxony, Germany, a leading European semiconductor hub, is deepening its ties with Taiwan, as TSMC expands its European footprint. This strategic partnership, fueled by over EUR50 billion in industry investments, aims to position Saxony as a global semiconductor powerhouse, centered in Dresden’s “Silicon Saxony.”
Beyond chips, the collaboration extends
The European Commission has approved Poland’s plan to provide over 7.4 billion zlotys ($1.91 billion) in state aid to support Intel’s construction of a new semiconductor assembly and test facility near Wroclaw. This green light marks a significant step forward in the project, which is expected to be finalized by
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[Sep 13, 2024] – Foxconn, a leading global electronics manufacturer, and HCL Technologies, a leading Indian technology services company, have taken a significant step towards establishing a semiconductor plant in Uttar Pradesh, India. The joint venture (JV) between the two companies has secured a 30-acre plot of land in Noida, near
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Bac Ninh, Vietnam – September 13, 2023 – Amkor Technology, a leading global provider of semiconductor packaging and test services, has announced significant progress in its operations at its new facility in Bac Ninh, Vietnam. The company, which commenced operations in August 2023, is already experiencing strong growth and contributing to
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Seoul, South Korea – [Sep 14, 2024] – SK Keyfoundry, the dedicated logic foundry unit of SK Hynix, continues to expand its footprint in the specialty foundry market. The company has recently announced the launch of its fourth-generation 180nm Bipolar-CMOS-DMOS (BCDMOS) process, further strengthening its technological capabilities in power-demanding applications
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September 13, 2024 — Enosemi, a silicon photonics chiplet and IP provider, announced today the availability of a portfolio of high-speed electronic and photonic design IP in the GF Fotonix(TM) IP catalog. The silicon-proven design IP enables Fotonix users to accelerate their time-to-market for next-generation photonic integrated circuits. Enosemi has multiple
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Vanguard International Semiconductor Corp (VIS) and Episil Technologies Inc. announced today a strategic partnership to build an 8-inch silicon carbide (SiC) wafer fabrication facility in Taiwan. The collaboration, facilitated by an equity acquisition deal, will see VIS acquire a 13% stake in Episil for NT$2.48 billion (US$77.1 million).
The
This weeks, Taiwan’s foundries and OSAT’s reported their August revenue. TSMC showing very strong year on year (YoY) growth due to it’s dominance of advanced technology for AI and smartphone applications.
TSMC Dominates with Advanced Technology
TSMC, the world’s largest contract chipmaker, reported August revenue of US$7.8 billion, a
Meyreuil, France – September 12th – Presto Engineering, a leading European expert in application-specific integrated circuit (ASIC) design, engineering and production services, proudly announces becoming member of the MEDICALPS cluster. This initiative is part of Presto Engineering’s ongoing commitment to understanding the challenges and needs of medical device companies, ensuring continued
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