Get the semiconductor daily news directly to you by subscribing to our email list. For ASIC designer and managers, staying updated with the latest news, technologies, and trends is crucial. Here are the lastest news from the semiconductor industry.
October 15, 2024 – Xscape Photonics, a pioneer in next-generation data center connectivity, today announced the closing of a $44 million Series A funding round, bringing its total funding to $57 million. The round was led by IAG Capital Partners and included participation from Cisco Systems Inc., Nvidia Corp., Altair
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October 15, 2024 – CG Power and Industrial Solutions Limited, a Murugappa Group company, today announced the acquisition of Renesas Electronics Corporation’s radio frequency (RF) components business for USD 36 million. This strategic acquisition marks CG Power’s entry into the semiconductor design sector, a high-growth and high-profitability market.
The
October 15, 2024 – ASML Holding NV, a leading semiconductor equipment maker, announced a revised sales forecast for 2025, projecting net sales between €30 billion and €35 billion. This represents the lower end of the company’s previously stated range. The announcement, released a day early due to a technical error,
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Hsinchu, Taiwan [9-Oct-2024] – Taiwan Semiconductor Manufacturing Company (TSMC) (TWSE: 2330, NYSE: TSM) today announced a significant investment in Vanguard International Semiconductor Corporation (VIS), further solidifying its position in the global semiconductor industry. TSMC has acquired 42,485,831 shares of VIS at NT$88 per share, representing a total investment of approximately
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Micron Technology, Inc. (Nasdaq: MU), a global leader in memory and storage solutions, today announced a significant expansion of its U.S. manufacturing operations, fueled by a $6.1 billion grant from the CHIPS and Science Act. This investment, totaling approximately $50 billion through 2030, will bolster domestic memory chip production, strengthen
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Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, and Kiwimoore, a global leader in AI networking full-stack interconnect products and solutions, announced today that their jointly developed 2.5D packaging platform has successfully entered the mass production stage. The one-stop advanced packaging platform and service developed
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Samsung Foundry is accelerating its efforts to establish mass production capabilities for its 2nm process technology, according to industry sources. The company is actively equipping its “S3” foundry line at the Hwaseong plant, aiming for a monthly capacity of 7,000 wafers by Q1 2024. Further expansion is planned with the
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Global semiconductor sales soared to a record $53.1 billion in August, marking a significant 20.6% year-over-year increase, according to the Semiconductor Industry Association (SIA). This surge, the highest since April 2022, underscores the robust momentum in the semiconductor industry, driven primarily by the burgeoning demand from the artificial intelligence (AI)
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What is QFP IC Package?
In semiconductor technology, packaging with compact size and high performance is in high demand. Among several discovered semiconductor packaging technologies, Quad Flat Package (QFP) has been vibrant in electronics packaging, as presented in Figure 1.
QFP package is a mature semiconductor packaging technology for
Introduction to Semiconductor
Semiconductors have a small energy gap between the conduction and valance bands, and their conductivity is between insulators and conductors. At absolute zero temperature, semiconductor materials are pure insulators and gradually increase with temperature. Temperature and doping are the two mechanisms to manage the conductivity of semiconductors.