Get the semiconductor daily news directly to you by subscribing to our email list. For ASIC designer and managers, staying updated with the latest news, technologies, and trends is crucial. Here are the lastest news from the semiconductor industry.
The SiP market was worth US$21.2 billion in 2022 and is projected to reach US$33.8 billion by 2028, growing at an 8.1% CAGR. This growth is fueled by trends like heterogeneous integration, chiplet technology, package optimization, and cost-efficiency, particularly in 5G, AI, HPC, autonomous driving, and IoT sectors. Yole Group’s
Read More
Hyderabad, October 26, 2023 — MosChip Technologies Limited is pleased to announce the appointment of Mr. Srinivasa Rao Kakumanu, commonly referred to as “KS,” as the new Chief Executive Officer (CEO) and Managing Director (MD). KS, with an extensive background in the Semiconductor and Embedded industry spanning nearly 30 years, brings
Read More
Belgium, October 24, 2023 – Sofics bv, a leading semiconductor integrated circuit IP provider announced that its TakeCharge® Electrostatic Discharge (ESD) solutions portfolio is now available for TSMC’s advanced 3nm process technology.
Interface ESD protection in the most advanced FinFET technology is challenging: ESD sensitivity is very high while
BURLINGTON, VT–Green Mountain Semiconductor Inc. (GMS), a custom circuit design provider, is proud to announce its recent achievement of a Phase I Small Business Innovation Research (SBIR) contract. This significant milestone underscores GMS’ commitment to pushing the boundaries of technology in support of space applications. The contract was granted under
Read More
Chiplets are a relatively recent advancement in semiconductor technology that involves breaking down a traditional monolithic integrated circuit (IC) into smaller, individual semiconductor components or “chiplets.” These chiplets can be designed and manufactured independently, and then they are integrated onto a common substrate or package to create a more complex
Read More
Reading, UK – 17 October 2023. Sondrel (AIM: SND), is pleased to announce that it is one of the founding members of Arm® Total Design, an ecosystem that is committed to bringing Arm Neoverse™ CSS-based designs to market. Arm Neoverse CSS features high-end Arm Neoverse cores that are designed for
Read More
Flip chip , also known as “controlled-collapse chip connection” (C4), is an advanced semiconductor packaging technique that allows the direct attachment of a semiconductor chip, typically an integrated circuit (IC), to a substrate or circuit board. Unlike traditional packaging methods like wire bonding, in flip chip technology, the active side
Read More
LAWRENCEVILLE, GA – October 16, 2023 — Silicon Creations, a leading supplier of high-performance analog and mixed-signal intellectual property (IP), has been recognized by TSMC as the recipient of the 2023 OIP Partner of the Year Award for Analog/Mixed Signal IP. The OIP Partner of the Year award honors TSMC Open Innovation
Read More
In the world of computers, we’re used to thinking in terms of simple “on” and “off” signals, like flipping a light switch. But imagine if your computer could do much more than that—like being in two states at once! This is where quantum silicon chips come into play.
Read More
Meyreuil, France – October 5, 2023 – Presto Engineering, a recognized expert in ASIC design and semiconductor engineering and production services, is pleased to announce its collaboration with Nokia for the industrialization of new equipment designed to build the foundations of the next generation of microwave links as part of
Read More